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DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. TOUCH SCREEN CONTROLLER AND FINGERPRINT SENSORS Basic Functional Analysis Reports (FAR) capture the key metrics that you need to reveal trends in your socket. By comparing these key metrics across several devices you can learn where innovation is happening and make an informed decision about which devices you deeperanalyze.
PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
WW2.CHIPWORKS.COM
First Name * Last Name * Corporate Email * SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn. PATENT ANALYTICS SOLUTIONS The Chipworks Patent Analytics solution, powered by KMX, has been specifically developed and trained to meet the needs of IP professionals who process thousands of patents in the semiconductor and electronics markets every day.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. TOUCH SCREEN CONTROLLER AND FINGERPRINT SENSORS Basic Functional Analysis Reports (FAR) capture the key metrics that you need to reveal trends in your socket. By comparing these key metrics across several devices you can learn where innovation is happening and make an informed decision about which devices you deeperanalyze.
PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
WW2.CHIPWORKS.COM
First Name * Last Name * Corporate Email * SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. PATENT ANALYTICS SOLUTIONS The Chipworks Patent Analytics solution, powered by KMX, has been specifically developed and trained to meet the needs of IP professionals who process thousands of patents in the semiconductor and electronics markets every day.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. TOUCH SCREEN CONTROLLER AND FINGERPRINT SENSORS Basic Functional Analysis Reports (FAR) capture the key metrics that you need to reveal trends in your socket. By comparing these key metrics across several devices you can learn where innovation is happening and make an informed decision about which devices you deeperanalyze.
PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
WW2.CHIPWORKS.COM
First Name * Last Name * Corporate Email * SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn. PATENT ANALYTICS SOLUTIONS The Chipworks Patent Analytics solution, powered by KMX, has been specifically developed and trained to meet the needs of IP professionals who process thousands of patents in the semiconductor and electronics markets every day.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. TOUCH SCREEN CONTROLLER AND FINGERPRINT SENSORS Basic Functional Analysis Reports (FAR) capture the key metrics that you need to reveal trends in your socket. By comparing these key metrics across several devices you can learn where innovation is happening and make an informed decision about which devices you deeperanalyze.
PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
WW2.CHIPWORKS.COM
First Name * Last Name * Corporate Email * SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. SEMINAR: CROSS-BORDER COMMERCIALIZATION Thank you for your interest in the Cross-border Commercialization – Patent and IP Strategies and Best Practices Seminar scheduled for October 23rd in Hsinchu. PATENT ANALYTICS SOLUTIONS The Chipworks Patent Analytics solution, powered by KMX, has been specifically developed and trained to meet the needs of IP professionals who process thousands of patents in the semiconductor and electronics markets every day.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. SONY AND SAMSUNG IMAGE SENSORS Sony and Samsung Image Sensors. │. │. Chipworks has authored multiple reports on the Sony IMX214 CMOS Image Sensor and the Samsung S5KVB2XX09 CMOS Image Sensor. CMOS Image Sensors. Sony IMX214 CMOS Image Sensors. The Sony IMX214 CMOS Image Sensor reports include: Partial Circuit Analysis. Image Sensor Process Review Report. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE.WW2.CHIPWORKS.COM
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Yes Would you like to receive email updates from us? PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP PATENT ANALYTICS SOLUTIONS The Chipworks Patent Analytics solution, powered by KMX, has been specifically developed and trained to meet the needs of IP professionals who process thousands of patents in the semiconductor and electronics markets every day.DESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. IPHONE 6 AND 6 PLUS RELATED REPORTS The Apple A8 has two billion transistors twice that of the A7 and is built on TSMC’s 20 nm process with 4 core GPU. SONY AND SAMSUNG IMAGE SENSORS Sony and Samsung Image Sensors. │. │. Chipworks has authored multiple reports on the Sony IMX214 CMOS Image Sensor and the Samsung S5KVB2XX09 CMOS Image Sensor. CMOS Image Sensors. Sony IMX214 CMOS Image Sensors. The Sony IMX214 CMOS Image Sensor reports include: Partial Circuit Analysis. Image Sensor Process Review Report. QUALCOMM RF360 CIRCUIT REPORTS Qualcomm states that the RF360 mobile front end has over 225 total design wins across 40 OEMs. Chipworks can confirm the QFE1100 envelope tracker was uncovered in 23 different handsets with several OEMs ranging from Apple to ZTE.WW2.CHIPWORKS.COM
Schedule a Meeting with TechInsights. First Name * Last Name *SIGN IN - PARDOT
Yes Would you like to receive email updates from us? PATENT ANALYTICS WHITE PAPER This paper discusses where and how tools can be used by Intellectual Property professionals to streamline the evaluation process and revealpatents of value.
IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IPDESIGN WIN TRACKER
Design Win Tracker Design win tracker is an annual subscription service that reports on the full genealogy of all the phone and tablet teardowns completed by Chipworks. IPHONE 6 TEARDOWN EVENT iPhone 6 and 6 Plus Related Reports. Fill out the form below to receive an email as soon as we have information on our iPhone 6 related reports. Be sure to keep an eye on our Twitter and LinkedIn pages to get in-depth competitive technical intelligence on the. iPhone 6. Twitter LinkedIn. SONY AND SAMSUNG IMAGE SENSORS Sony and Samsung Image Sensors. │. │. Chipworks has authored multiple reports on the Sony IMX214 CMOS Image Sensor and the Samsung S5KVB2XX09 CMOS Image Sensor. CMOS Image Sensors. Sony IMX214 CMOS Image Sensors. The Sony IMX214 CMOS Image Sensor reports include: Partial Circuit Analysis. Image Sensor Process Review Report. SEMINAR: CROSS-BORDER COMMERCIALIZATION Seminar: Cross-border Commercialization – Patent and IP TOUCH SCREEN CONTROLLER AND FINGERPRINT SENSORS Basic Functional Analysis Reports (FAR) capture the key metrics that you need to reveal trends in your socket. By comparing these key metrics across several devices you can learn where innovation is happening and make an informed decision about which devices you deeperanalyze.
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UNLOCKING THE SECRETS OF THE YMTC 64-LAYER 3D XTACKING® NAND FLASH A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside. As first published in Semiconductor Digest.Read More
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SIC POWER TRANSISTOR PROCESS FLOW ANALYSIS: THE ROHM SCT3022ALGC11PROCESS FLOW
Contributed Author: Sinjin Dixon-Warren The market for Silicon Carbide (SiC) power transistors is expected to grow considerably over the coming years. SiC power transistors have several advantages over traditional silicon-based devices, includingRead More
05May
PATENT PORTFOLIO MANAGEMENT: EFFECTIVE STRATEGIES AND BEST PRACTICESIN 2020
April 29 - 12:00-1:30 pm (ET) – Live webinar, "Patent Portfolio Management: Effective Strategies and Best Practices in 2020", hosted by The Knowledge Group. Key topics include: Patent Portfolio Management Trends and Developments, The Essentials of anRead More
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ANALYSIS OF QUALCOMM'S SNAPDRAGON SDR865 TRANSCEIVER; SUPPORTING 5G SUB-6 GHZ AND LTE SERVICES The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings toRead More
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LOOKING AT THE APPLE A12Z BIONIC SYSTEM ON CHIP Is the Apple A12Z bionic SoC just the A12X renamed, with an enabled GPU core? When we first got the Apple iPad Pro 2020 A2068 in our labs, this was the first thing we wanted to know. What is the A12Z? When we saw the A12Z, there was visually noRead More
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TECHINSIGHTS CONFIRMS SAMSUNG’S TRUE 7LPP PROCESS IN THE SAMSUNGEXYNOS 990
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YMTC IS CHINA'S FIRST MASS PRODUCER OF 3D NAND FLASH MEMORY CHIPS Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC hasRead More
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SAMSUNG GALAXY S20 ULTRA 5G CAMERA TEARDOWN Contributing Authors: Ray Fontaine Congratulations to the Samsung team for not only delivering a well spec’d camera system, but also for being first to market with 0.7 µm generation pixels! The GH1 stacked imager, announced in September 2019 , is inRead More
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SAMSUNG GALAXY S20 ULTRA 5G TEARDOWN ANALYSIS Contributing Authors: Daniel Yang, Ray Fontaine It is an especially busy time in TechInsights’ labs. Just a few days after we started the teardown of various models of the Xiaomi Mi 10 flagship series - the world’s first Qualcomm Snapdragon 865Read More
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RECENT ANALYSIS OF SAMSUNG’S MOBILE RF COMPONENTS Shannon 5800 55M5800A01 As the industry expands its use of 5G, Samsung continues to innovate in the area of mobile communication technologies, including RF transceivers and phased array solutions for mmWave along with 5G-embedded mobile processors.Read More
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How many layers can 3D flash memory stack? Just as skyscrapers cannot be piled up indefinitely, the number of layers of 3D flash memory isalso limited.
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PC TECHNOLOGY TRENDS 2020-DRAM AND FLASH 新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。Read More
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12Dec
POWER INTEGRATIONS SCORES OEM DESIGN WIN WITH THEIR POWIGAN TECHNOLOGY Posted: December 12, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Consumer demand for smaller form factor and higher power, plus government efficiency regulations , are driving innovation in the USB adapter market. The USB-C power deliveryRead More
12Dec
TOSHIBA-WD ALLIANCE 3D NAND MASS PRODUCTION WILL USE SAMSUNG TCATPROCESS
集微网消息(文/Yuna),据Impress Watch网站报道,东芝在12月8日 召开的IEDM会议上声明在3D NAND闪存量产中采用类似于三星TCAT的存储单元结构。Read More
12Dec
DEVELOPING A SUCCESSFUL LICENSING PROGRAM As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.Read More
25Nov
DRAM SCALING CHALLENGES GROW More nodes and alternative memories are in the works, but schedulesremain murky.
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21Nov
COMET LAKE FOR DESKTOP WILL APPEAR AROUND FEBRUARY 2020? INTEL CPUROADMAP
TechInsights released a digest report titled “Intel Core i7-1065G7“ Ice Lake ”10 nm 2nd Gen Processor Analysis” onOctober 31st .
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18Nov
KIRIN 990 5G CORE DATA EXPOSURE: 113.31 SQUARE MILLIMETERS INTEGRATED 10.3 BILLION TRANSISTORS Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.Read More
12Nov
THE APPLE U1 - DELAYERING THE CHIP AND ITS POSSIBILITIES Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing thisRead More
08Nov
HUAWEI MATE 30 PRO 5G TEARDOWN Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich.Read More
07Nov
TIPS WEBINAR: TECHNIQUES TO ANALYZE NAND FLASH AND SSD DEVICES Date: November 6, 2019 / 3:00pm to 4:00pm ET Presented By: Neil MacLeod and Marty Bijman Internal Probing, Waveform Analysis, and More The widespread adoption and expansion of data centers has driven the SSD market to a period of high competition andRead More
06Nov
INTEL CORE I7-1065G7 “ICE LAKE” 10 NM 2ND GEN PROCESSOR ANALYSIS Intel has released their first 10 nm 2 nd Gen processor into consumer products – the Intel Core i7-1065G7 processor, better known as Ice Lake. Dell and Microsoft have already announced the inclusion of Ice Lake in some of their latest offerings. ThisRead More
31Oct
THE EVOLUTION OF SIC MOSFET TECHNOLOGY: A RETROSPECTIVE Posted: October 31, 2019 Contributing Author: Sinjin Dixon-Warren Silicon carbide (SiC) is a widely used industrial material. Widescale production by the Carborundum Company started in 1893 following the discovery of the Acheson process, which isRead More
31Oct
THE APPLE IPHONE 11, 11 PRO & 11 PRO MAX REVIEW: PERFORMANCE, BATTERY,& CAMERA ELEVATED
TechInsights has now officially released a die shot of the new Apple A13 , and we can confirm a few assumptions on our side.Read More
27Oct
APPLE U1 TMKA75 ULTRA WIDEBAND (UWB) CHIP ANALYSIS One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directionalRead More
24Oct
TECHINSIGHTS: IPHONE 11 PRO MAX CAMERAS COST $73.5 TechInsights publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at$73.50.
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09Oct
HOW E-MOBILITY IS CHANGING THE AUTOMOTIVE With some TechInsights industry experts, Morahari Reddy and Jianchun Xu, we will analyze the market and focus on different aspects.Read More
07Oct
E-GOVERNMENT - DEEP ANALYSIS OF INTEL ICE LAKE: INNOVATION ACROSS SIXPILLARS
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lakeprocessor.
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07Oct
SK HYNIX 96L 3D PUC NAND ANALYSIS Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUCRead More
27Sep
INSIDE THE APPLE 1720 CHARGER INCLUDED WITH THE IPHONE 11 PRO MAX Posted: September 27, 2019 Contributing Author: Sinjin Dixon-Warren The iPhone 11 Pro Max ships with the Apple 1720 18 W USB-C power delivery charger. This device is rated to delivery 5 V and 3 A or 9 V and 2 A. In follow up to our recent blogRead More
27Sep
TECHINSIGHTS ANALYSES IPHONE 11 CAMERAS TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:Read More
26Sep
APPLE IPHONE 11 PRO TEARDOWNS LOOK ENCOURAGING FOR STMICRO AND SONY STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.Read More
26Sep
APPLE IPHONE 11 PRO MAX TEARDOWN Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple eventRead More
23Sep
PATENT LICENSING: THE PATENT BATTLEPLAN Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.Read More
23Sep
WEBINAR: PREPARING TO LICENSE: USING TOOLS TO SCALE YOUR LICENSINGPROGRAM
Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will notRead More
19Sep
MICRON ANALYSIS OVERVIEW: LPDDR4 DDR4 3D NAND FLASH AND XPOINT REVERSEENGINEERED
Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their productRead More
17Sep
HOW GRAPHICAL SOLUTIONS IMPROVE 3D NAND EFFECTIVE DEVICE DENSITY Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.Read More
16Sep
WEBINAR: POWER SEMICONDUCTOR – A MARKET OVERVIEW & IN-DEPTH SIC ANDGAN DEVICE ANALYSIS
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for moreRead More
10Sep
LITHIUM, THE WHITE GOLD OF TECHNOLOGY The price of the mineral collapses, but the batteries continue to consume this white king.Read More
10Sep
MOBILE MANUFACTURING: HOW MUCH DO COMPANIES EARN WITH THE HIGH END? High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.Read More
08Sep
PELOTON IPO PREVIEW: ALL HYPE, NO MUSCLE Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.Read More
03Sep
UN MÓVIL DE GAMA ALTA SE VENDE CASI AL TRIPLE DE LO QUE CUESTAFABRICARLO
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen lasRead More
02Sep
A HIGH-END MOBILE PHONE SELLS ALMOST THREE TIMES WHAT IT COSTS TOMANUFACTURE IT
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications toRead More
02Sep
TARIFFS ON CHINESE IMPORTS START ON SUNDAY. NEWS 8 LOOKS AT WHAT THEYWILL COST YOU
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs ondifferent items.
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31Aug
WHY I KEEP WRITING ’BOUT HOLES IN THE SENSOR DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modulesRead More
31Aug
DECA TECHNOLOGIES FAN-IN WLP IN QUALCOMM PM8150 Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packagingRead More
29Aug
GAN, SIC, AND SI TECHNOLOGIES IN AC ADAPTERS Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile deviceRead More
14Aug
UNEXPECTED DESIGN WINS IN HUAWEI MATE 20 X (5G) TEARDOWN 2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on SamsungRead More
02Aug
PART 4: NON-BAYER CFA, PHASE DETECTION AUTOFOCUS (PDAF) 4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International ImageRead More
30Jul
PART 3: BACK-ILLUMINATED ACTIVE SI THICKNESS, DEEP TRENCH ISOLATION(DTI)
4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for theRead More
23Jul
VELODYNE LIDAR PUCK TEARDOWN Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotiveRead More
22Jul
PART 2: PIXEL SCALING AND SCALING ENABLERS 4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors WorkshopRead More
16Jul
AC ADAPTERS: GAN, SIC OR SI? Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.Read More
16Jul
PART 1: CHIP-STACKING AND CHIP-TO-CHIP INTERCONNECT 4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International ImageRead More
09Jul
AMBIQ MICRO APOLLO 3 BLUE ULTRA-LOW POWER MCU Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019Read More
10Jun
1Y DDR4 DRAM FROM SAMSUNG, SK HYNIX AND MICRON Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone wasRead More
05Jun
HOW LONG CAN SONY KEEP THE TOP SPOT IN THE IMAGE SENSOR MARKET? Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.Read More
05Jun
QUALCOMM QTM052 MMWAVE ANTENNA MODULE Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challengesRead More
31May
NAND TECHNOLOGY: OPEN THE GATES In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsightsexplain.
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13May
WEBINAR: IDENTIFYING AND PURSUING PATENT INFRINGERS - USING TECHNICAL EVIDENCE TO BUILD YOUR ASSERTION CAMPAIGN At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.Read More
02May
ELECTRIC CARS GAIN TRACTION, BUT CHALLENGES REMAIN (Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption inthe market.
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22Apr
TECHINSIGHTS MEMORY TECHNOLOGY UPDATE FROM IEDM18 Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendeesRead More
11Apr
9X LAYER 3D NAND ANALYSIS Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96LRead More
10Apr
SAMSUNG GALAXY S10 5G TEARDOWN Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the worldRead More
09Apr
ANALYZING INNOVATIONS IN MOBILE RADIO FREQUENCY FRONT-END INTEGRATION Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to supportRead More
09Apr
WEBINAR: HIGH-DENSITY FAN-OUT PACKAGE TECHNOLOGIES – EXAMINATION ANDCOMPARISON
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, thisRead More
09Apr
3D NAND METROLOGY CHALLENGES GROWING (Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “dueRead More
09Apr
AUTONOMOUS VEHICLES ARE DRIVING INNOVATION Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.Read More
29Mar
SIEMENS PATENT FILINGS CLIMB, BUT QUALITY OVER QUANTITY IS THE NAME OFTHE GAME
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested...
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25Mar
SAMSUNG GALAXY S10+ TEARDOWN Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been inRead More
01Mar
WEBINAR: THE MOBILE RADIO FREQUENCY LANDSCAPE Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improveRead More
27Feb
LENOVO BRINGS THE NEW SNAPDRAGON TO MARKET Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sellRead More
20Feb
NAVITAS FOUND INSIDE THE RAVPOWER RP-PC104-W GALLIUM NITRIDE 45 W USB C POWER DELIVERY CHARGER Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely toRead More
07Feb
TESLA POISED TO APPLY MAXWELL’S DRY ELECTRODE INNOVATION TO BATTERYCELL FABRICATION
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, andRead More
07Feb
WEBINAR: FINDING EVIDENCE OF USE IN TECHNOLOGY - THE GOOD, THE BAD,AND THE UGLY
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents canRead More
12Dec
WEBINAR: USING TECHNICAL EVIDENCE TO STRENGTHEN PATENTS Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once itRead More
23Oct
WEBINAR: OPTIMIZING PATENT PROSECUTION TO ACHIEVE STRONGER, MOREVALUABLE PATENTS
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –Read More
04Oct
WEBINAR: COMPARING LEADING STBS, STREAMING DEVICES, AND SMART TVS - A DESIGN AND BOM PERSPECTIVE Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streamingRead More
18Sep
AUTOMOTIVE PATENTS: OWNERS, TECHNOLOGIES, AND INVESTIGATING FOR EOU Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future ofRead More
11Jul
CREATING BETTER APPLICATIONS THROUGH PATENT STRENGTHENING Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.Read More
20Jun
INTEL 10 NM LOGIC PROCESS ANALYSIS (CANNON LAKE) Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistorRead More
12Jun
SK HYNIX 72L 3D NAND ANALYSIS Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming timeRead More
31May
WEBINAR: BLACK BOX REVEAL - INVESTIGATING PATENTED TECHNOLOGY IN CHALLENGING PRODUCT AREAS Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These canRead More
03May
WHAT DOES UBER’S PATENT LANDSCAPE LOOK LIKE? Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 yearsRead More
27Feb
WEBINAR: PATENT PORTFOLIO MONETIZATION KEY CONSIDERATIONS FOR COMPANIES IN 2018 AND BEYOND Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –Read More
20Feb
WEBINAR: UNLOCKING THE VALUE IN SOFTWARE PATENTS - A TECHNICALPERSPECTIVE
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ET Hosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes softwareRead More
01Feb
COVID-19
We have been closely monitoring the progress of COVID-19 in recent weeks, regularly updating our travel and operations policies to include increasingly strict restrictions we have chosen to implement. Our priority is ensuring the continued health andRead More
04Mar
JOB VACANCY: VP FINANCE Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporateRead More
16Jul
JOB VACANCY: SEMICONDUCTOR ANALYST The Semiconductor Analyst will participate in major campaigns and projects initiated client-facing team, and related to analysis of devices manufactured with advanced semiconductor process technology.Read More
03May
JOB VACANCY: SALES EXECUTIVE - EMEA As a Sales Executive, your mission will be to establish and develop accounts within Europe and be accountable for driving the sales process from initial engagement to close.Read More
23Apr
JOB VACANCY: SENIOR TECHNOLOGY ANALYST - LOGIC PROCESSORS In this role, you will drive the technical analysis product roadmap for TechInsights, based on a deep understanding of customer interests and industry direction.Read More
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