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HOME - DSPE
Lorem ipsum dolor sit amet, consectetur adipiscing elit. Nam consectetur, massa non gravida faucibus, libero eros elementum ipsum, quis vehicula orci felis vitae lectus. Aenean condimentum nulla in scelerisque pretium.JOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS Chapter 5 - Measurement 5.2.6 Semiconductor temperature sensors. The semiconductor (or IC for integrated circuit) temperature sensor is an electronic device fabricated in a similar way to other modern electronic semiconductor components such as microprocessors. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperatureSEARCH - DSPE
Professor Wim van der Hoek As part of the 25th anniversary of Janssen Precision Engineering (JPE) Professor Emeritus Wim van der Hoek (92) performed the official opening of a new conference room.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
5.1 CONTACTLESS TEMPERATURE SENSORS Chapter 5 - Measurement 5.1 Contactless temperature sensors. Every object emits electromagnetic radiation, and the spectrum and intensity of this radiation varies mainly with temperature.MIKRONIEK ARCHIVE
Mikroniek is the professional magazine of DSPE, containing technical articles and information about precision engineering. It appears six times a year and is distributed among professionals and companies in the precision engineering community in the Netherlands and abroad. Copies of more than one year old can be downloaded here. Recent copies are reserved for members and are distributed in print.HOME - DSPE
Lorem ipsum dolor sit amet, consectetur adipiscing elit. Nam consectetur, massa non gravida faucibus, libero eros elementum ipsum, quis vehicula orci felis vitae lectus. Aenean condimentum nulla in scelerisque pretium.JOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS Chapter 5 - Measurement 5.2.6 Semiconductor temperature sensors. The semiconductor (or IC for integrated circuit) temperature sensor is an electronic device fabricated in a similar way to other modern electronic semiconductor components such as microprocessors. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperatureSEARCH - DSPE
Professor Wim van der Hoek As part of the 25th anniversary of Janssen Precision Engineering (JPE) Professor Emeritus Wim van der Hoek (92) performed the official opening of a new conference room.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
5.1 CONTACTLESS TEMPERATURE SENSORS Chapter 5 - Measurement 5.1 Contactless temperature sensors. Every object emits electromagnetic radiation, and the spectrum and intensity of this radiation varies mainly with temperature.MIKRONIEK ARCHIVE
Mikroniek is the professional magazine of DSPE, containing technical articles and information about precision engineering. It appears six times a year and is distributed among professionals and companies in the precision engineering community in the Netherlands and abroad. Copies of more than one year old can be downloaded here. Recent copies are reserved for members and are distributed in print.ABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities.MEMBERS - DSPE
A total of nine nominees Technical talent, crucial for the future of the Dutch high-tech industry, is graduating at a high level at universities and universities ofSEARCH - DSPE
Professor Wim van der Hoek As part of the 25th anniversary of Janssen Precision Engineering (JPE) Professor Emeritus Wim van der Hoek (92) performed the official opening of a new conference room. 5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS Chapter 5 - Measurement 5.2.6 Semiconductor temperature sensors. The semiconductor (or IC for integrated circuit) temperature sensor is an electronic device fabricated in a similar way to other modern electronic semiconductor components such as microprocessors. 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.LIGHTWEIGHT DESIGN
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
DESIGN FOR MINIMAL COST AND COMPLEXITY Design for minimal cost and complexity. Balancing and hence minimization of complexity and related cost via a multidisciplinarysystem approach
DESIGN FOR STIFFNESS Dutch Society for Precision Engineering (DSPE): Independent professional branch organization since 1954 for all precision engineers in the NL. DESIGN FOR LOW HYSTERESIS Design for low hysteresis. Minimization of friction and virtual play in high-precision structures, connections and guideways DESIGN FOR LOW SENSITIVITY (SHORT TERM) Design for low sensitivity (short term) Isolation of disturbances e.g. via isolated metrology loop, thermal isolation, offset minimization e.g. rules of Abbe and Bryan, and drive offset minimization relativeto
HOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperatureMIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS The absolute temperature can be calculated from the equation: T = (V1 – V2) / (8.7248×10-5 ln ( I1 / I2)) The result is in Kelvins (K). This is the method employed by most integrated circuit temperatures sensors and explains why some output a signal proportional to absolute temperature. Accuracy ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
CONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. 5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
LUMP MASS MODEL
Lump Mass model – steady state. In this calculator you can calculate the steady state. temperatures of a network of bodies. Follow the steps, and if you are. ready press the button calculate and evaluate the results in the graph. In a lumped capacity model, a thermal system is divided in to. Heat Capacities.HOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperatureMIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS The absolute temperature can be calculated from the equation: T = (V1 – V2) / (8.7248×10-5 ln ( I1 / I2)) The result is in Kelvins (K). This is the method employed by most integrated circuit temperatures sensors and explains why some output a signal proportional to absolute temperature. Accuracy ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
CONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. 5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
LUMP MASS MODEL
Lump Mass model – steady state. In this calculator you can calculate the steady state. temperatures of a network of bodies. Follow the steps, and if you are. ready press the button calculate and evaluate the results in the graph. In a lumped capacity model, a thermal system is divided in to. Heat Capacities.ABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities.EVENTS - DSPE
DSPE Conference 2021 on Precision Mechatronics September 14 & 15. “Good re-union and meeting new people, great balance between listening and networking, fun, entertaining, very constructive, new developments, received a lot of. More info. 15 Jun 2021 TheNetherlands.
MEMBERS - DSPE
A total of nine nominees Technical talent, crucial for the future of the Dutch high-tech industry, is graduating at a high level at universities and universities ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
LIGHTWEIGHT DESIGN
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
DESIGN FOR LOW HYSTERESIS Design for low hysteresis. Minimization of friction and virtual play in high-precision structures, connections and guidewaysCONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. DESIGN FOR LOAD COMPENSATION Design for load compensation. Application of weight-compensation, reaction force compensation and (parasitic) stiffness compensation, high-bandwidth feedback control DESIGN FOR MINIMAL COST AND COMPLEXITY Design for minimal cost and complexity. Balancing and hence minimization of complexity and related cost via a multidisciplinarysystem approach
DESIGN FOR LOW SENSITIVITY (SHORT TERM) Design for low sensitivity (short term) Isolation of disturbances e.g. via isolated metrology loop, thermal isolation, offset minimization e.g. rules of Abbe and Bryan, and drive offset minimization relativeto
HOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event isABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS The absolute temperature can be calculated from the equation: T = (V1 – V2) / (8.7248×10-5 ln ( I1 / I2)) The result is in Kelvins (K). This is the method employed by most integrated circuit temperatures sensors and explains why some output a signal proportional to absolute temperature. Accuracy ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
CONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. 5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
HOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event isABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.2.6 SEMICONDUCTOR TEMPERATURE SENSORS The absolute temperature can be calculated from the equation: T = (V1 – V2) / (8.7248×10-5 ln ( I1 / I2)) The result is in Kelvins (K). This is the method employed by most integrated circuit temperatures sensors and explains why some output a signal proportional to absolute temperature. Accuracy ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
CONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. 5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
MEMBERS - DSPE
A total of nine nominees Technical talent, crucial for the future of the Dutch high-tech industry, is graduating at a high level at universities and universities ofRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
CONDUCTION - DSPE
The Fourier's law of heat conduction is a basic law describing a linear conductive heat flux (heat flow per unit area ) through a material. Heat flows in the direction opposite to the thermal gradient, thus, from hot to cold. The rate at which this happens is determined by the temperature difference (K) and the thermal conductivity (W/(m K)) of the material. DUTCH SOCIETY FOR PRECISION ENGINEERING Characteristics DSPE members and their professionals •The professionals have a passion for precision engineering. •They operate from the content of precision engineering. THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
TRANSIENT TEMPERATURE CALCULATOR Transient temperature calculator. In this calculator you can calculate the steady state temperatures of a network. As well as the temperatures as function of time. Follow the steps, and if you are ready press the button calculate and evaluate the results in thegraph. In a
4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node. WATCH INNOVATION BASED ON COMPLIANT MECHANISMS … mikroniek is a publication of the dutch society for precision engineering – www.dspe.nl 2021 (vol. 61) issue 2 professional journal on precision engineering theme: microsystems watch innovation based on compliant mechanisms NO MORE GEAR BACKLASH THANKS TO DUAL-LOOP CONTROL No more gear backlash thanks to dual-loop control. Can loads be positioned dynamically, with high precision and no oscillation, despite mechanical backlash and elastic components? maxon offers a solution by means of dual-loop control, as a way of Julie van Stiphout- Sassen.
DSPE BOARDMEMBER RECEIVED HIS PHD DEGREE DSPE boardmember received his PhD degree. Matthijs van Gastel recently received his PhD degree for his thesis “Automated sub-micron accurate #optical #fiberalignment for #photonic applications”. Research from Matthijs has shown an improved method of constructing #fiberarrays, which could significantly improve efficiency and lowerHOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event isJOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information.SEARCH - DSPE
It covers the design of a positioning platform for nano-precision high-throughput metrology based Mikroniek December 2020: Systems engineering. The December issue of Mikroniek features the theme of systems engineering & design methodology. It focuses on the Dutch approach to systems engineering (SE) at high-tech companies, knowledge 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. 4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
MIKRONIEK ARCHIVE
Mikroniek is the professional magazine of DSPE, containing technical articles and information about precision engineering. It appears six times a year and is distributed among professionals and companies in the precision engineering community in the Netherlands and abroad. Copies of more than one year old can be downloaded here. Recent copies are reserved for members and are distributed in print.HOME - DSPE
Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event isJOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information.SEARCH - DSPE
It covers the design of a positioning platform for nano-precision high-throughput metrology based Mikroniek December 2020: Systems engineering. The December issue of Mikroniek features the theme of systems engineering & design methodology. It focuses on the Dutch approach to systems engineering (SE) at high-tech companies, knowledge 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD. 4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
MIKRONIEK ARCHIVE
Mikroniek is the professional magazine of DSPE, containing technical articles and information about precision engineering. It appears six times a year and is distributed among professionals and companies in the precision engineering community in the Netherlands and abroad. Copies of more than one year old can be downloaded here. Recent copies are reserved for members and are distributed in print.ABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities.SEARCH - DSPE
It covers the design of a positioning platform for nano-precision high-throughput metrology based Mikroniek December 2020: Systems engineering. The December issue of Mikroniek features the theme of systems engineering & design methodology. It focuses on the Dutch approach to systems engineering (SE) at high-tech companies, knowledgeCHAPTER 1: BASICS
Chapter 1: Basics. The basics chapter gives an overview of thermomechanics and some rules of thumb. Please read our following chapters: Temperature, heat and heat capacity. Heat transfer. Principles of thermal deformations. Thermo-mechanical beam equations. 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level.RADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
5.2.1 THERMOCOUPLES
5 °C (at 1000°C) Suited for high temperature measurements. Unusually, type B thermocouples give the same output at 0 °C and 42 C. This makes them useless below 50 °C. Type E. (Chromel / Constantan) -200 to 900. 1.7 °C. Type E has a high output (68 V/°C) which makes it WATCH INNOVATION BASED ON COMPLIANT MECHANISMS … mikroniek is a publication of the dutch society for precision engineering – www.dspe.nl 2021 (vol. 61) issue 2 professional journal on precision engineering theme: microsystems watch innovation based on compliant mechanisms NO MORE GEAR BACKLASH THANKS TO DUAL-LOOP CONTROL No more gear backlash thanks to dual-loop control. Can loads be positioned dynamically, with high precision and no oscillation, despite mechanical backlash and elastic components? maxon offers a solution by means of dual-loop control, as a way of Julie van Stiphout- Sassen.
DSPE BOARDMEMBER RECEIVED HIS PHD DEGREE DSPE boardmember received his PhD degree. Matthijs van Gastel recently received his PhD degree for his thesis “Automated sub-micron accurate #optical #fiberalignment for #photonic applications”. Research from Matthijs has shown an improved method of constructing #fiberarrays, which could significantly improve efficiency and lowerNUMERICAL EXAMPLE
Numerical example. The Net-radiation method describes the radiosity balance of the different surfaces. Tracing of the exact source of the surface radiosity is not possible, but it can be used to calculated to balance in radiosity and the temperatures needed for this balance. Note: The heat-exchange between two surfaces cannot be solved directly HOME - DSPEDSPE PEGDSPE PEG MANNOSEDSPE SHADERS MCPEDSPE PEG FITCDSPE PEG2KDSPE PEG BIOTIN Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
SEARCH - DSPE
Successful pilot of new training. August 08, 2014 – The training ‘Advanced mechatronic system design’ (AMSD) is set-up in a masterclass manner with a mix of presentations and exercises by renowned system architects in combination Lunch Lecture March hostedby.
4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node. MARTIN VAN DEN BRINK AWARD Martin van den Brink Award 2012. In 2012, the DSPE Advisory Board suggested that another award would be welcome, for the best system architect in precision engineering. A name was found easily. By far Martin van den Brink is the most successful system architect in the Netherlands, bringing ASML to where it HOME - DSPEDSPE PEGDSPE PEG MANNOSEDSPE SHADERS MCPEDSPE PEG FITCDSPE PEG2KDSPE PEG BIOTIN Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
SEARCH - DSPE
Successful pilot of new training. August 08, 2014 – The training ‘Advanced mechatronic system design’ (AMSD) is set-up in a masterclass manner with a mix of presentations and exercises by renowned system architects in combination Lunch Lecture March hostedby.
4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node. MARTIN VAN DEN BRINK AWARD Martin van den Brink Award 2012. In 2012, the DSPE Advisory Board suggested that another award would be welcome, for the best system architect in precision engineering. A name was found easily. By far Martin van den Brink is the most successful system architect in the Netherlands, bringing ASML to where itABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities.EDUCATION - DSPE
DSPE has taken the initiative to improve the level of knowledge and cooperation in the field of precision engineering in the Netherlands with a new postgraduate program aiming at certification of precision engineers. Based on the demands in the market, the DSPE has selected and qualified the best post-academic courses for precision engineers.JOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information. LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)CONTACT - DSPE
With precision training to specialist. Frank de Groot, senior engineer at Tegema, has been awarded the Bronze ECP2 certificate. He achieved this by following a number of courses that have been certified in the ECP2 Wim van der Hoek Award. During the 18th edition of the Precision Fair, the Wim van der Hoek Award 2018 was presented underRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
1.2 HEAT TRANSFER
1.2 Heat transfer. In the previous example heat was transferred via conduction, one of the three fundamental modes of heat transfer. These are: 1) Conduction. A group of molecules vibrating with more energy (thus, higher temperature) interact with nearby slower-moving molecules and transfer some of that kinetic energy.5.2.1 THERMOCOUPLES
5 °C (at 1000°C) Suited for high temperature measurements. Unusually, type B thermocouples give the same output at 0 °C and 42 C. This makes them useless below 50 °C. Type E. (Chromel / Constantan) -200 to 900. 1.7 °C. Type E has a high output (68 V/°C) which makes itTHERMOMECHANICS
Thermomechanics. As the area of thermomechanics is becoming increasingly important in precision engineering, the DSPE, together with thermomechanical engineers, have taken the initiative to create a dedicated website about this subject. The purpose of this website is primarily to give an introduction to thermomechanics for precisionengineers.
HOME - DSPEDSPE PEGDSPE PEG MANNOSEDSPE SHADERS MCPEDSPE PEG FITCDSPE PEG2KDSPE PEG BIOTIN Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
SEARCH - DSPE
Successful pilot of new training. August 08, 2014 – The training ‘Advanced mechatronic system design’ (AMSD) is set-up in a masterclass manner with a mix of presentations and exercises by renowned system architects in combination Lunch Lecture March hostedby.
4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node. MARTIN VAN DEN BRINK AWARD Martin van den Brink Award 2012. In 2012, the DSPE Advisory Board suggested that another award would be welcome, for the best system architect in precision engineering. A name was found easily. By far Martin van den Brink is the most successful system architect in the Netherlands, bringing ASML to where it HOME - DSPEDSPE PEGDSPE PEG MANNOSEDSPE SHADERS MCPEDSPE PEG FITCDSPE PEG2KDSPE PEG BIOTIN Home - DSPE. 6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15. Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is 1.1 TEMPERATURE, HEAT AND HEAT CAPACITY Chapter 1 - Basics 1.1 Temperature, heat and heat capacity. Any object contains a certain amount of thermal energy. Thermal energy is the energy contained in the kinetic energy of the random motion of molecules in a body on a macroscopic level. 1.3 PRINCIPLES OF THERMAL DEFORMATION The coefficient of thermal expansion describes how the size of an object changes with a change in temperature. For solid materials with a significant length, an estimate of the amount of thermal expansion can be described by the ratio ΔL / L initial or linear strain:. where ΔL / L initial is the ratio of thermal strain, L initial is the initial length before the change of temperature LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)MIKRONIEK - DSPE
The magazine for precision engineers. Mikroniek is a professional journal on precision engineering and the official organ of DSPE. It provides current information about scientific, technical and business developments in the fields of precision engineering, mechatronics andoptics.
5.1 CONTACTLESS TEMPERATURE SENSORS Sensing the emitted radiation of an object is the basis of contactless temperature measurement. The sensing element of a bolometer is in principle a temperature dependent resistor (RTD) material with a high thermal absorptivity. The resistance of the element can be measured just as in any other RTD.EXECUTIVE BOARD
High Tech Campus 1 5656 AE Eindhoven PO Box 80036 5600 JW Eindhoven.info@dspe.nl
SEARCH - DSPE
Successful pilot of new training. August 08, 2014 – The training ‘Advanced mechatronic system design’ (AMSD) is set-up in a masterclass manner with a mix of presentations and exercises by renowned system architects in combination Lunch Lecture March hostedby.
4.2 LUMPED CAPACITANCE MODELING The information collected in the tables can be entered in a template (eg Calculator: Lumped mass – steady state .) The actual calculation of the lumped capacitance model is the solution of a system of equations. There are two basic equations: Q=TC* ΔT – heat flow through a couplingd. T/dt = ΣQ/C – Total heating rate of a node. MARTIN VAN DEN BRINK AWARD Martin van den Brink Award 2012. In 2012, the DSPE Advisory Board suggested that another award would be welcome, for the best system architect in precision engineering. A name was found easily. By far Martin van den Brink is the most successful system architect in the Netherlands, bringing ASML to where itABOUT DSPE - DSPE
About DSPE . The Dutch Society for Precision Engineering (DSPE) is a professional community for precision engineers: from scientists to craftsmen, employed from laboratories to workshops, from multinationals to small companies and universities.EDUCATION - DSPE
DSPE has taken the initiative to improve the level of knowledge and cooperation in the field of precision engineering in the Netherlands with a new postgraduate program aiming at certification of precision engineers. Based on the demands in the market, the DSPE has selected and qualified the best post-academic courses for precision engineers.JOINING THE DSPE
Joining the DSPE . If you are interested in joining the DSPE, please contact us by email or by the contact form below for more information. LIST OF CERTIFIED COURSES List of certified courses . Course (content partner) CPE points Provider Basic Mechatronics system design – part 1 (Mechatronics Academy) 5 HTI Mechatronics system design – part 2 (Mechatronics Academy) 5 HTI Design principles (Mikrocentrum) / Constructieprincipes voor precisietechnologie (Mikrocentrum)CONTACT - DSPE
With precision training to specialist. Frank de Groot, senior engineer at Tegema, has been awarded the Bronze ECP2 certificate. He achieved this by following a number of courses that have been certified in the ECP2 Wim van der Hoek Award. During the 18th edition of the Precision Fair, the Wim van der Hoek Award 2018 was presented underRADIATION - DSPE
Radiation. Heat transfer from every object in the form of electromagnetic radiation (or photons). Radiative heat transfer does not require a “medium”, i.e. occurs also in vacuum. The wavelength of the radiation (energy of the photons) depends on the temperature of the object. Objects hotter than 1000K emit radiation at visiblewavelengths.
THERMAL CONTACT CONDUCTION An important kind of heat transfer is thermal contact conduction, in which heat is transferred over a mechanical contact between two objects. This “contact conduction” is normally considered as a combination of the three fundamental modes of heat transfer (seefigure below):
1.2 HEAT TRANSFER
1.2 Heat transfer. In the previous example heat was transferred via conduction, one of the three fundamental modes of heat transfer. These are: 1) Conduction. A group of molecules vibrating with more energy (thus, higher temperature) interact with nearby slower-moving molecules and transfer some of that kinetic energy.THERMOMECHANICS
Thermomechanics. As the area of thermomechanics is becoming increasingly important in precision engineering, the DSPE, together with thermomechanical engineers, have taken the initiative to create a dedicated website about this subject. The purpose of this website is primarily to give an introduction to thermomechanics for precisionengineers.
5.2.1 THERMOCOUPLES
5 °C (at 1000°C) Suited for high temperature measurements. Unusually, type B thermocouples give the same output at 0 °C and 42 C. This makes them useless below 50 °C. Type E. (Chromel / Constantan) -200 to 900. 1.7 °C. Type E has a high output (68 V/°C) which makes it* Home
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* Chapter 4: Thermo-mechanical modeling * 4.1 Important variables * 4.2 Lumped capacitance modeling * 4.3 Advanced hand calculations * Chapter 5: Measurement * 5.1 Contactless temperature sensors * 5.2 Contact sensors * 5.2.1 Thermocouples * 5.2.2 Resistance thermometers PTC * 5.2.3 Resistance thermometers PRT * 5.2.4 PTC thermistor (alias posistor) * 5.2.5 Resistance thermometers NTC * 5.2.6 Semiconductor temperature sensors * 5.2.7 Other types of contact sensors* Calculators
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6 May 2021 DSPE Knowledge Day Precision Engineering in Vacuum June 15 Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The online event is highly relevant for…Read more
27 May 2021 1 mins DSPE Conference 2021 September 14… We are happy to annouce the preliminary program for the special edition of the DSPE…Read more
4 May 2021 1 mins Lunch lecture June 7 hosted… This DSPE Lunch Lecture is hosted by ASM Pacific Technology The title is “Settling performance improvements…Read more
6 May 2021 1 mins Mikroniek April 2021: Watch innovation… The April issue of Mikroniek features the theme of microsystems. The cover story presents watch…Read more
17 April 2021 1 mins DSPE boardmember received his PhD… Matthijs van Gastel recently received his PhD degree for his thesis “Automated sub-micron accurate #optical #fiberalignment for #photonic applications”.Research from…
Read more
7 May 2021 1 mins Tuning the stiffness of compliant… Compliant ortho-planar mechanisms can be fabricated from a single sheet of material and they can…Read more
6 May 2021 1 mins Watch innovation based on compliant… Earlier this year, Swiss watchmaker Frederique Constant launched a technological breakthrough in the field of…Read more
No more gear backlash thanks to… Can loads be positioned dynamically, with high precision and no oscillation, despite mechanical backlash and elastic components? maxon offers a solution by means of dual-loop…Read more
Wim van der Hoek Boek (in… Bestel hier het boek “Wim van der Hoek (1924-2019) – Een constructief leven” Kaleidoscopisch boek over grondlegger Nederlandse mechatronica-industrie Wim van der Hoek legde als…Read more
Mikroniek December 2020: Systems engineering and… The December issue of Mikroniek features the theme of systems engineering & design methodology. It focuses on the Dutch approach to systems engineering (SE) at…Read more
Continuous evolution of 60-year-old laser technology Sixty years after its inception, laser technology is still steadily evolving and a large number of industrial applications have been developed over this period. In…Read more
Improving hexapod positioning performance through compensation… In hexapods using six length-adjustable struts for positioning an end-effector, the compliance (or inversely, the stiffness) of individual components or structures, such as these struts,…Read more
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WIM VAN DER HOEK'S CAREER Begin 2019 is Wim van der Hoek op 94-jarige leeftijd overleden. Dit boek bestrijkt zijn persoonlijke en werkzame leven en biedt analyses en illustraties van zijn nalatenschap. Voormalige collega’s enstudenten...
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14 Sep 2021 The Netherlands DSPE CONFERENCE 2021 ON PRECISION MECHATRONICS SEPTEMBER 14 & 15 “Good re-union and meeting new people, great balance between listening and networking, fun, entertaining, very constructive, new developments, received a lot of feedback, like a warm blanket, very balanced program, hospitality...More info
15 Jun 2021 The Netherlands DSPE KNOWLEDGE DAY PRECISION ENGINEERING IN VACUUM Join the DSPE Knowledge Day “Precision Engineering in Vacuum” This online afternoon addresses vacuum technology from design, analysis and test point of view. The event is highly relevant for precision...More info
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