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SEMICONDUCTOR B2B Workplace中文(简体)
Samsung Open the Menu* PRODUCTS
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ALIGN YOUR DESIGN VISION WITH MCP By expertly combining mobile DRAM and NAND in a compact package, Samsung developed a full MCP lineup for cutting-edge performance anddesign
VARIED LINEUP OF MCP OPTIONS - NUMEROUS COMBINATIONS FOR DESIGN FLEXIBILITY With numerous optimized MCP options and dual controllers, Samsung supports total design flexibility for all market segments, such as smartphones, wearables, AI, and IoT devices. SEAMLESS INTEGRATION AND SYNERGY - RESPONSIVE SUPPORT FROM THE LEADER IN MEMORY Samsung’s expertise in developing MCP mobile DRAM and NAND components accelerates time to market and provides the leading high-bandwidth memory technology, reliable supply and rapidtroubleshooting.
PERFECT ULTRA-SLIM MOBILE DESIGNS - SMARTER STACKING, MORE SPACE FOR DESIGN Samsung’s thinner chip-stacking innovation creates smaller form factors and greater design possibilities. Enhanced Mobile DRAM for Samsung MCP also reduces power needs and extends battery life.PRODUCT SELECTOR
ESTORAGE DEN.
ESTORAGE VER.
DRAM DEN.
DRAM TYPE
PACKAGE
SPEED
PRODUCT STATUS
8 GB
64 GB
32 GB
256 GB
16 GB
128 GB
eMMC 5.1
UFS3.1
UFS2.1
96 Gb
80 Gb
8 Gb
64 Gb
48 Gb
32 Gb
24 Gb
16 Gb
LPDDR5
LPDDR4X
LPDDR3
297FBGA
254FBGA
221FBGA
6400Mbps
4266Mbps
1866 Mbps
Sample
Mass Production
select PART NUMBER__SORT PART NUMBER IN DESCENDING ORDER ESTORAGE DEN.__SORT ESTORAGE DEN. IN DESCENDING ORDER ESTORAGE VER.__SORT ESTORAGE VER. IN DESCENDING ORDER DRAM DEN.__SORT DRAM DEN. IN DESCENDING ORDER DRAM TYPE__SORT DRAM TYPE IN DESCENDING ORDER PACKAGE__SORT PACKAGE IN DESCENDING ORDER SPEED__SORT SPEED IN DESCENDING ORDER PRODUCT STATUS__SORT PRODUCT STATUS IN DESCENDING ORDER select KM2F8001CM-B707256 GB
UFS2.1
48 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM2P8001CM-B51864 GB
UFS2.1
48 Gb
LPDDR4X
254FBGA
4266Mbps
Sample
select KM2V8001CM-B707128 GB
UFS2.1
48 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM3P6001CM-B51764 GB
UFS2.1
32 Gb
LPDDR4X
254FBGA
4266Mbps
Sample
select KM4X6001KM-B32132 GB
eMMC 5.1
16 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM5C7001DM-B62264 GB
UFS2.1
32 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM5H80018M-B42464 GB
UFS2.1
24 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM5P8001DM-B42464 GB
UFS2.1
32 Gb
LPDDR4X
254FBGA
4266Mbps
Sample
select KM5V8001DM-B622128 GB
UFS2.1
32 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8F8001JA-B813256 GB
UFS2.1
64 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8F8001JM-B813256 GB
UFS2.1
64 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8F8001LM-B813256 GB
UFS2.1
80 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8F8001MM-B813256 GB
UFS2.1
96 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8V8001JM-B813128 GB
UFS2.1
64 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KM8V8001LM-B813128 GB
UFS2.1
80 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KMAG9001PM-B814128 GB
UFS3.1
64 Gb
LPDDR5
297FBGA
6400Mbps
Sample
select KMAS9001PM-BC02256 GB
UFS3.1
64 Gb
LPDDR5
297FBGA
6400Mbps
Sample
select KMDP60018M-B42564 GB
eMMC 5.1
24 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KMDP6001DA-B42564 GB
eMMC 5.1
32 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KMDX60018M-B42532 GB
eMMC 5.1
24 Gb
LPDDR4X
254FBGA
4266Mbps
Mass Production
select KMFE60012A-B21416 GB
eMMC 5.1
8 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
select KMFN60012B-B2148 GB
eMMC 5.1
8 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
select KMGP6001BA-B51432 GB
eMMC 5.1
16 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
select KMGX6001BA-B51432 GB
eMMC 5.1
24 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
select KMQE60013B-B31816 GB
eMMC 5.1
16 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
select KMQX60013A-B41932 GB
eMMC 5.1
16 Gb
LPDDR3
221FBGA
1866 Mbps
Mass Production
compare
export
COMPARISON
Please check the comparison item if you want to data comparison.Close Menu
RELATED SOLUTIONS
Mobile
Powering the next generation of mobile devicesLEARN MORE
RELATED INSIGHTS
SAMSUNG ELECTRONICS BEGINS MASS PRODUCTION OF INDUSTRY'S FIRST 12GBLPDDR4X-BASED UMCP
Utilizing the industry's first 24Gb LPDDR4X chips, this highest-capacity uMCP makes 10+ GB memory solutions available to mid-market smartphone users.LEARN MORE
SAMSUNG SHOWCASES ITS LATEST SILICON TECHNOLOGIES FOR THE NEXT WAVE OF INNOVATION AT ANNUAL TECH DAY Samsung’s new-generation processors and memory solutions set to power innovation across mobile, home, data center, and automotivemarkets.
LEARN MORE
CHIP STACKS BRING SMARTPHONE FEATURES TO MORE CONSUMERS uMCP is set to be the new shining light in mobile memory and it’s helping mid-range phones look a lot more impressiveLEARN MORE
SAMSUNG PREVIEWS NEXT-GENERATION MEMORY SOLUTIONS Samsung proposed next-generation memory technologies and solutions for new business possibilities at Tech Day 2019.LEARN MORE
SAMSUNG ELECTRONICS BEGINS MASS PRODUCTION OF INDUSTRY'S FIRST 12GBLPDDR4X-BASED UMCP
Utilizing the industry's first 24Gb LPDDR4X chips, this highest-capacity uMCP makes 10+ GB memory solutions available to mid-market smartphone users.LEARN MORE
SAMSUNG SHOWCASES ITS LATEST SILICON TECHNOLOGIES FOR THE NEXT WAVE OF INNOVATION AT ANNUAL TECH DAY Samsung’s new-generation processors and memory solutions set to power innovation across mobile, home, data center, and automotivemarkets.
LEARN MORE
CHIP STACKS BRING SMARTPHONE FEATURES TO MORE CONSUMERS uMCP is set to be the new shining light in mobile memory and it’s helping mid-range phones look a lot more impressiveLEARN MORE
SAMSUNG PREVIEWS NEXT-GENERATION MEMORY SOLUTIONS Samsung proposed next-generation memory technologies and solutions for new business possibilities at Tech Day 2019.LEARN MORE
* slide1
* slide2
All product specifications reflect internal test results and are subject to variations by user’s system configuration. All product images shown are for illustration purposes only and may not be an exact representation of the product. Samsung reserves the right to change product images and specifications at any time without notice. You are entering _samsungha.com_ CONTINUE CANCEL Close LayerBack to Top
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