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SPRINT™ SERIES
Unparalleled fine features sharpness and readability. High Depth-of-Focus (DOF) of 1.5mm. Registration accuracy of ±35μm. A wide range of panel thicknesses - from 0.1mm up to 7.5 mm. Extensive functions for product traceability and quality control. Prints on Rigid, Rigid-Flex and Flex PCB using approved inks. Fully automated ormanual operation.
DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf.FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, small NUVOGO™ SERIES FOR HDI, FLEX AND ADVANCED MLB Nuvogo™ Series is a next-generation direct imaging (DI) solution capable of imaging on almost every resist type, affording maximum flexibility to PCB makers. Powered by MultiWave Laser Technology™, Nuvogo™ generates a multi wavelength laser beam for optimal line structure. This provides PCB manufacturers the ability to chooselower-cost
LP - HOME PAGE
LP™-9 Family Benefits Orbotech’s LP™-9 suite of field-proven, automated laser plotters deliver the highest performance in laser plotting. The LP™-9 family includes four state-of-the-art systems, providing manufacturers with the very latest in laser plotting technology to meet all production requirements. Groundbreaking, UltraHigh-Speed
HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACT Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device.SPRINT™ SERIES
Unparalleled fine features sharpness and readability. High Depth-of-Focus (DOF) of 1.5mm. Registration accuracy of ±35μm. A wide range of panel thicknesses - from 0.1mm up to 7.5 mm. Extensive functions for product traceability and quality control. Prints on Rigid, Rigid-Flex and Flex PCB using approved inks. Fully automated ormanual operation.
DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf.FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, small NUVOGO™ SERIES FOR HDI, FLEX AND ADVANCED MLB Nuvogo™ Series is a next-generation direct imaging (DI) solution capable of imaging on almost every resist type, affording maximum flexibility to PCB makers. Powered by MultiWave Laser Technology™, Nuvogo™ generates a multi wavelength laser beam for optimal line structure. This provides PCB manufacturers the ability to chooselower-cost
LP - HOME PAGE
LP™-9 Family Benefits Orbotech’s LP™-9 suite of field-proven, automated laser plotters deliver the highest performance in laser plotting. The LP™-9 family includes four state-of-the-art systems, providing manufacturers with the very latest in laser plotting technology to meet all production requirements. Groundbreaking, UltraHigh-Speed
ORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask.PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3D AOI-PCB - AUTOMATED OPTICAL PCB INSPECTION Orbotech's solutions include: Cost-effective/high-end products suited for QTA and sampling production needs. Comprehensive range of AOI products and systems designed for mid to high-volume, advanced PCB and HDI production. Cutting-edge solutions for IC Substrate applications: BGA/CSP, FC-BGAs, advanced PBGA/CSP and COFs. INFLOW™ | ORBOTECH InFlow™ is a robust, fully automated, all-in-one engineering software solution for PCB manufacturers that reduces process planning time by up to 60%, accelerates time to market, increases productivity and standardizes workflows and outputs. Designed for mass production and high design complexity, InFlow offers full coverage of the entire NUVOGO™ SERIES FOR HDI, FLEX AND ADVANCED MLB Nuvogo™ Series is a next-generation direct imaging (DI) solution capable of imaging on almost every resist type, affording maximum flexibility to PCB makers. Powered by MultiWave Laser Technology™, Nuvogo™ generates a multi wavelength laser beam for optimal line structure. This provides PCB manufacturers the ability to chooselower-cost
ORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
LP - ORBOTECH
LP™-9 Family Benefits Orbotech’s LP™-9 suite of field-proven, automated laser plotters deliver the highest performance in laser plotting. The LP™-9 family includes four state-of-the-art systems, providing manufacturers with the very latest in laser plotting technology to meet all production requirements. Groundbreaking, UltraHigh-Speed
HOME PAGE | ORBOTECH Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device.PERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production.PARAGON -ULTRA 200X
Paragon™-Ultra 200X Featuring the leading-edge performance of Orbotech’s Large Scan Optics (LSO) Technology™, Paragon™-Ultra 200X delivers the highest imaging accuracy and yields for today’s most complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and KLA-TENCOR ANNOUNCES AGREEMENT TO ACQUIRE ORBOTECH LTD MILPITAS, Calif., and YAVNE, Israel, March 19, 2018 – KLA-Tencor Corporation (NASDAQ: KLAC) (“KLA-Tencor”) and Orbotech Ltd. (“Orbotech”) today announced they had entered into a definitive agreement pursuant to which KLA-Tencor will acquire Orbotech Ltd. (“Orbotech”) for $38.86 in cash and 0.25 of a share of KLA-Tencorcommon
IMPROVING ALN & SCALN THIN FILM TECHNOLOGY FOR NEXT Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS SEMICON Taiwan 2016 - MEMS FORUM Nick Knight PVD Product Manager, SPTS Technologies HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACT Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device. SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf.ORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
SPRINT™ SERIES
Powered by Orbotech DotStream Pro Technology™, Sprint™ 200 and Sprint™ 150 systems deliver cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most advanced legend designs to meet any manufacturing vol NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, smallFUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
ORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask.PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3DPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACT Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device. SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf.ORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
SPRINT™ SERIES
Powered by Orbotech DotStream Pro Technology™, Sprint™ 200 and Sprint™ 150 systems deliver cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most advanced legend designs to meet any manufacturing vol NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, smallFUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
ORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask.PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3DPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. AOI-PCB - AUTOMATED OPTICAL PCB INSPECTION Orbotech's solutions include: Cost-effective/high-end products suited for QTA and sampling production needs. Comprehensive range of AOI products and systems designed for mid to high-volume, advanced PCB and HDI production. Cutting-edge solutions for IC Substrate applications: BGA/CSP, FC-BGAs, advanced PBGA/CSP and COFs. NUVOGO™ SERIES FOR HDI, FLEX AND ADVANCED MLB Nuvogo™ Series is a next-generation direct imaging (DI) solution capable of imaging on almost every resist type, affording maximum flexibility to PCB makers. Powered by MultiWave Laser Technology™, Nuvogo™ generates a multi wavelength laser beam for optimal line structure. This provides PCB manufacturers the ability to chooselower-cost
DISCOVERY™ II SERIES Moving the world’ s best- selling AOI series to the next level of performance, Discovery™ II systems deliver new capabilities for greater operational efficiency. The system ensures high defect detection with full flexibility to handle today’ s challenging KLA COMPLETES ACQUISITION OF ORBOTECH LTD MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). "We are very pleased to have completed the acquisition of Orbotech," said Rick Wallace, president and CEO ofKLA.
INCAMPRO. IT’S A NEW CAM ERA. InCAM®Pro. It’s a new CAM era. InCAM®Pro • The fastest CAM we’ve ever made. • The most intuitive user interface we’ve ever made. • More responsive to evolving needs. ULTRA DIMENSIONTM 800 Automated Optical Inspection (AOI) ULTRA DIMENSION TM 800 PCB Production Solutions Sharp Blur 2 Blur 4 Blur 8 Ultrra Dimension 800_10_2017 Specifications Technology Range Down to PERFIXTM 200S / 200S XL PerFix™ 200S / 200S XL, Orbotech’s latest innovation in Automated Optical Shaping (AOS), perfectly shapes shorts and any excess copper defects with high precision. PerFix™ 200S / 200S XL enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix™PARAGON -ULTRA 200X
Paragon™-Ultra 200X Featuring the leading-edge performance of Orbotech’s Large Scan Optics (LSO) Technology™, Paragon™-Ultra 200X delivers the highest imaging accuracy and yields for today’s most complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and KLA-TENCOR ANNOUNCES AGREEMENT TO ACQUIRE ORBOTECH LTD MILPITAS, Calif., and YAVNE, Israel, March 19, 2018 – KLA-Tencor Corporation (NASDAQ: KLAC) (“KLA-Tencor”) and Orbotech Ltd. (“Orbotech”) today announced they had entered into a definitive agreement pursuant to which KLA-Tencor will acquire Orbotech Ltd. (“Orbotech”) for $38.86 in cash and 0.25 of a share of KLA-Tencorcommon
IMPROVING ALN & SCALN THIN FILM TECHNOLOGY FOR NEXT Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS SEMICON Taiwan 2016 - MEMS FORUM Nick Knight PVD Product Manager, SPTS Technologies HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACT Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device.SPRINT™ SERIES
Unparalleled fine features sharpness and readability. High Depth-of-Focus (DOF) of 1.5mm. Registration accuracy of ±35μm. A wide range of panel thicknesses - from 0.1mm up to 7.5 mm. Extensive functions for product traceability and quality control. Prints on Rigid, Rigid-Flex and Flex PCB using approved inks. Fully automated ormanual operation.
SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf. NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, smallORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
ORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask.FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3DPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACT Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device.SPRINT™ SERIES
Unparalleled fine features sharpness and readability. High Depth-of-Focus (DOF) of 1.5mm. Registration accuracy of ±35μm. A wide range of panel thicknesses - from 0.1mm up to 7.5 mm. Extensive functions for product traceability and quality control. Prints on Rigid, Rigid-Flex and Flex PCB using approved inks. Fully automated ormanual operation.
SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf. NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, smallORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
ORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask.FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallel DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3DPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. AOI-PCB - AUTOMATED OPTICAL PCB INSPECTION Orbotech's solutions include: Cost-effective/high-end products suited for QTA and sampling production needs. Comprehensive range of AOI products and systems designed for mid to high-volume, advanced PCB and HDI production. Cutting-edge solutions for IC Substrate applications: BGA/CSP, FC-BGAs, advanced PBGA/CSP and COFs.SPRINT™ SERIES
Powered by Orbotech DotStream Pro Technology™, Sprint™ 200 and Sprint™ 150 systems deliver cost-effective, top quality industrial inkjet printing for a consistently accurate production of even the most advanced legend designs to meet any manufacturing vol NUVOGO™ SERIES FOR HDI, FLEX AND ADVANCED MLB Nuvogo™ Series is a next-generation direct imaging (DI) solution capable of imaging on almost every resist type, affording maximum flexibility to PCB makers. Powered by MultiWave Laser Technology™, Nuvogo™ generates a multi wavelength laser beam for optimal line structure. This provides PCB manufacturers the ability to chooselower-cost
KLA COMPLETES ACQUISITION OF ORBOTECH LTD MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). "We are very pleased to have completed the acquisition of Orbotech," said Rick Wallace, president and CEO ofKLA.
PARAGON -ULTRA 200X
Paragon™-Ultra 200X Featuring the leading-edge performance of Orbotech’s Large Scan Optics (LSO) Technology™, Paragon™-Ultra 200X delivers the highest imaging accuracy and yields for today’s most complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and PERFIXTM 200S / 200S XL PerFix™ 200S / 200S XL, Orbotech’s latest innovation in Automated Optical Shaping (AOS), perfectly shapes shorts and any excess copper defects with high precision. PerFix™ 200S / 200S XL enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix™ ULTRA DIMENSIONTM 800 Automated Optical Inspection (AOI) ULTRA DIMENSION TM 800 PCB Production Solutions Sharp Blur 2 Blur 4 Blur 8 Ultrra Dimension 800_10_2017 Specifications Technology Range Down to KLA-TENCOR ANNOUNCES AGREEMENT TO ACQUIRE ORBOTECH LTD MILPITAS, Calif., and YAVNE, Israel, March 19, 2018 – KLA-Tencor Corporation (NASDAQ: KLAC) (“KLA-Tencor”) and Orbotech Ltd. (“Orbotech”) today announced they had entered into a definitive agreement pursuant to which KLA-Tencor will acquire Orbotech Ltd. (“Orbotech”) for $38.86 in cash and 0.25 of a share of KLA-Tencorcommon
公司概述
公司概述.
奥宝科技是全球领先的电子产品微制造领域制造流程创新、解决方案和设备供应商。. 奥宝科技在产品开发和应用方面拥有 30 余年的成熟经验,主要为印刷电路板、平板显示器、先进封装、微电子机械系统和其他电子元件制造商提供高精准度、可持续 オルボテックについて オルボテックについて. ハイテク業界は要求が厳しく、市場の変化も急速で不確定な世界です。企業は最高の品質を実現しながらも最短納期の実現や価格問題などといった問題を解決できる革新的な技術的ソリューションを絶えず求めています。 HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACTORBOTECHANNUAL REPORT
Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device. NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, small SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf. DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallelORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3D KLA COMPLETES ACQUISITION OF ORBOTECH LTD February 20, 2019. MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). "We are very pleased to have completed the acquisitionPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. CASE IMPROVING MTBC FOR STUDY SIN ETCH www.orbotech.com/spts CASE STUDY Improving MTBC for SiN Etch Background Many RF devices rely on the precise and repeatable processing of GaAs substrates containing HOME PAGE | ORBOTECHCOMPANYPCBFPDNEWS & EVENTSCAREERSCONTACTORBOTECHANNUAL REPORT
Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device. NUVOGO™ FINE SERIES FOR ADVANCED HDI AND FLEX Nuvogo™ is a next-generation direct imaging (DI) solution capable of imaging on every resist type, affording maximum flexibility to PCB makers. Designed to streamline the manufacturing processes for today’s electronic devices as they become thinner, small SOLDER MASK SOLUTIONS Raising the DI bar for solder mask applications, Orbotech Diamond is a high-end mass production solution that enhances imaging accuracy while decreasing the manufacturer’s total cost of ownership (TCO). Solutions. Min SRO; Min DAM size. Orbotech Diamond™ 10/10X. 75µm, 50µm. Downloads. orbotech-diamond-10-xl.pdf. DIRECT IMAGING FOR SOLDER MASK Orbotech’s leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage Orbotech’s unique proprietary technologies to ensureconsistently
FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallelORBOTECH
Orbotech Diamond 10/10XL is an advanced high-capacity digital imaging (DI) solution for a wide variety of solder mask (SM) applications,including HDI, MLB
PRECISETM 800
Precise™ 800 is Orbotech’s latest innovation in Automated Optical Shaping (AOS). It is the world’s first one-stop solution that both removes excess copper and precisely completes patterns where copper is missing. It enables top quality 3D KLA COMPLETES ACQUISITION OF ORBOTECH LTD February 20, 2019. MILPITAS, Calif., Feb. 20, 2019 /PRNewswire/ -- KLA-Tencor Corporation (NASDAQ: KLAC) today announced the completion of the acquisition of Orbotech Ltd. (NASDAQ: ORBK). "We are very pleased to have completed the acquisitionPERFIXTM 200
PerFix™ 200, Orbotech’s latest innovation in automated optical Shaping (AOS), perfectly shapes shorts in seconds. With speed much faster than any existing system, PerFix™ 200 enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix ™ 200 moves the PCB industry closer to achieving zero scrap production. CASE IMPROVING MTBC FOR STUDY SIN ETCH www.orbotech.com/spts CASE STUDY Improving MTBC for SiN Etch Background Many RF devices rely on the precise and repeatable processing of GaAs substrates containing AOI-PCB - AUTOMATED OPTICAL PCB INSPECTION Orbotech's solutions include: Cost-effective/high-end products suited for QTA and sampling production needs. Comprehensive range of AOI products and systems designed for mid to high-volume, advanced PCB and HDI production. Cutting-edge solutions for IC Substrate applications: BGA/CSP, FC-BGAs, advanced PBGA/CSP and COFs.SPRINT™ SERIES
Unparalleled fine features sharpness and readability. High Depth-of-Focus (DOF) of 1.5mm. Registration accuracy of ±35μm. A wide range of panel thicknesses - from 0.1mm up to 7.5 mm. Extensive functions for product traceability and quality control. Prints on Rigid, Rigid-Flex and Flex PCB using approved inks. Fully automated ormanual operation.
FUSION™ SERIES
Fusion, Orbotech's latest AOI innovation, takes AOI expertise a major step forward creating a true revolution in PCB inspection. Utilizing breakthrough Multi-Image Technology™, Fusion inspects a panel with multiple light sources in one scan for unparallelORBOTECH DIAMOND 8
Orbotech, the worldwide leader in Digital Imaging (DI) for PCB patterning now introduces Orbotech Diamond™ 8, a mass production, high throughput and highly accurate DI solution for solder mask. ORBOTECH | POWERED BY LEAPFILE Important Notice: Any transmission of files, data or other items (collectively referred to as ''Material'') using this information exchange platform may be transferred to and stored in countries outside the country in which you are located; Material may be viewed by Orbotech personnel who are citizens of foreign nations.You should not transmit any Material which is or may be subject to export HOME PAGE | ORBOTECH Orbotech systems are used to produce virtually every electronic device in the world. Frontline introduces InFlow™, a robust, automated, all-in-one engineering software solution for PCB (printed circuit board) manufacturers. If playback doesn't begin shortly, try restarting your device. PERFIXTM 200S / 200S XL PerFix™ 200S / 200S XL, Orbotech’s latest innovation in Automated Optical Shaping (AOS), perfectly shapes shorts and any excess copper defects with high precision. PerFix™ 200S / 200S XL enables top quality shaping of most advanced PCB designs, including any-layer, HDI and complex multi-layer boards. Now more than ever, PerFix™PARAGON -ULTRA 200X
Paragon™-Ultra 200X Featuring the leading-edge performance of Orbotech’s Large Scan Optics (LSO) Technology™, Paragon™-Ultra 200X delivers the highest imaging accuracy and yields for today’s most complex IC substrate applications including Flip-Chip BGA, Flip-Chip CSP, BGA/CSP and ULTRA DIMENSIONTM 800 Automated Optical Inspection (AOI) ULTRA DIMENSION TM 800 PCB Production Solutions Sharp Blur 2 Blur 4 Blur 8 Ultrra Dimension 800_10_2017 Specifications Technology Range Down to IMPROVING ALN & SCALN THIN FILM TECHNOLOGY FOR NEXT Improving AlN & ScAlN Thin Film Technology for Next Generation PiezoMEMS SEMICON Taiwan 2016 - MEMS FORUM Nick Knight PVD Product Manager, SPTS TechnologiesMenu
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ORBOTECH IS PROUD TO BE A KLA COMPANY You will now be redirected to KLA’s investor relations pages ORBOTECH SYSTEMS ARE USED TO PRODUCE VIRTUALLY EVERY ELECTRONIC DEVICEIN THE WORLD
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With 3,000 employees and 50 offices around the world, Orbotech offers an extensive range of career opportunities in a stimulating and multi-cultural environmentVIDEO
ORBOTECH IN 90 SECONDS Technology is the most powerful force that exists today - changing the way we live, communicate and work for the better. We're proud to be part of the most significant technological breakthroughs.Find out more here
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