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SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated.. Constructionof an annular ring
HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design. PCB MANUFACTURING & ASSEMBLY IN THE USA Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated.. Constructionof an annular ring
HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design. PCB MANUFACTURING & ASSEMBLY IN THE USA Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
DESIGN RULE CHECK (DRC) FOR PCB MANUFACTURING Solder mask checks: Coming to solder mask clearance, we can typically define it as a general isolation recommendation alongside specific details characterized by the kind of surface element(s) being isolated.Particular specifications apply to pads, which may be solder mask defined or non-solder mask defined, and drill holes, which may be plate through-holes or non-plated through-holes. 12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. HOW TO MASTER HIGH DENSITY INTERCONNECT PCB DESIGN HDI PCBs are printed circuit boards that feature higher wiring density per surface area than standard PCBs. HDI PCBs use some or all the below features that reduce the size of the PCB: Lines and spaces less than or equal to 100 micrometers. Vias less than or equal to 150 micrometers. Capture pads less than or equal to 400 micrometers. WHAT IS SOLDER MASK LAYER? Solder mask is a thin layer of polymer that is put on a circuit board to protect the copper from oxidation and shorts during operation. It also protects the PCB from environmental influences such as dust and several other contaminants that may lead to shorts in the long run. Panels that are coated with solder mask. FREE PCB STACKUP PLANNER TOOL PCB Stackup Planner. An accurate and detailed PCB stack-up at the beginning stages of a layout reduces unnecessary iterations and helps optimize the costs by increasing manufacturability and electrical performance for a given design. This tool offers precise options for cost-optimized stack-up structures and has an integrated Impedance HOW TO USE VIA-IN-PAD FOR PCB DESIGN AND MANUFACTURING Here the via is placed directly on the copper pad of a surface-mounted component and plated with copper (VIPPO), as opposed to a conventional via in which the signal carrying trace is routed away from the pad (dog-bone), to the via. A via-in-pad serves the function of miniaturizing the PCB form factor by reducing the space taken up bytrace
IPC CLASS 2 VS CLASS 3: THE DIFFERENT DESIGN RULES Another topic Class 2 and Class 3 differ on is drill breakouts. Class 2 allows breakouts from the annular ring whereas Class 3 does not accept any lifted or fractured annular rings. Class 3 boards need to be highly reliable and when there is a breakout, it is too difficult to find out how much is really broken out and how much it really affects the connection with the pad.PCB COMPONENT QUIZ
PCB components are the functional part of the board and designers should know everything about them. Take this quiz to test your knowledge on PCB components.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. DESIGN RULE CHECK (DRC) FOR PCB MANUFACTURING To learn about pad design, read What is a Pad in PCB Design and Development?. Annular ring checks: To achieve acceptance for Class 2 and Class 3, follow the tables below published by Altium.The first one gives the annular ring requirements for mechanically drilled blind, buried, and through-holes on ½ oz copper:; Class 2 LEARN ABOUT DESIGNING PCB VIAS AND THEIR TYPES Via-in-pad design requires filling. Dog-bone design: Separate each via from its pad with a predefined short trace covered with solder mask. Ensure there is no mask clearance for the vias under BGA. The board documentation should include a drill file with tool codes and X-Y coordinates for all holes. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
COPPER WRAP PLATING REQUIREMENT FOR PCB MANUFACTURING The IPC 6021B standard has included a copper wrap plating requirement for via-in-pad structures. The filled copper plating should continue around the edge of the via hole and extend onto the annular ring surrounding the via pad. The requirement enhances the reliability of the via plating and can potentially minimize failure due to cracks or MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO REDUCE PARASITIC CAPACITANCE IN PCB LAYOUT Closely placed PCB conductors form a virtual capacitor, resulting in a parasitic capacitance effect. Parasitic capacitance or stray capacitance is the result of a virtual capacitor formed between two traces separated by a dielectric. It occurs due to the potential difference generated when the current-carrying traces run in closeproximity.
PCB SUBSTRATES: KNOWING YOUR PCB DIELECTRIC MATERIALSSEE MORE ONPROTOEXPRESS.COM
PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. DESIGN RULE CHECK (DRC) FOR PCB MANUFACTURING To learn about pad design, read What is a Pad in PCB Design and Development?. Annular ring checks: To achieve acceptance for Class 2 and Class 3, follow the tables below published by Altium.The first one gives the annular ring requirements for mechanically drilled blind, buried, and through-holes on ½ oz copper:; Class 2 LEARN ABOUT DESIGNING PCB VIAS AND THEIR TYPES Via-in-pad design requires filling. Dog-bone design: Separate each via from its pad with a predefined short trace covered with solder mask. Ensure there is no mask clearance for the vias under BGA. The board documentation should include a drill file with tool codes and X-Y coordinates for all holes. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
COPPER WRAP PLATING REQUIREMENT FOR PCB MANUFACTURING The IPC 6021B standard has included a copper wrap plating requirement for via-in-pad structures. The filled copper plating should continue around the edge of the via hole and extend onto the annular ring surrounding the via pad. The requirement enhances the reliability of the via plating and can potentially minimize failure due to cracks or MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO REDUCE PARASITIC CAPACITANCE IN PCB LAYOUT Closely placed PCB conductors form a virtual capacitor, resulting in a parasitic capacitance effect. Parasitic capacitance or stray capacitance is the result of a virtual capacitor formed between two traces separated by a dielectric. It occurs due to the potential difference generated when the current-carrying traces run in closeproximity.
PCB SUBSTRATES: KNOWING YOUR PCB DIELECTRIC MATERIALSSEE MORE ONPROTOEXPRESS.COM
PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
THE LIDAR MARKET
The global LiDAR market is expected to witness a CAGR of 14.1% during the forecast period to reach revenue of $2.91 billion by 2025.PCB DRILLING
A rule is a rule even for a hole. Plated through-hole (PTH): Finished hole size (minimum) = 4 mils. Annular ring size (minimum) = 3 mils. Drill diameter tolerances must be specified on the drill chart. Sierra Circuits prefers a drill diameter tolerance of +/- 0.003” for PTH and NPTH drills. The accuracy of the hole location is compromised ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of WHAT IS SOLDER MASK LAYER? Solder mask is a thin layer of polymer that is put on a circuit board to protect the copper from oxidation and shorts during operation. It also protects the PCB from environmental influences such as dust and several other contaminants that may lead to shorts in the long run. Panels that are coated with solder mask. PCB LINE SPACING FOR CREEPAGE AND CLEARANCE The minimum line spacing between PCB components and other traces is the distance required to withstand a given voltage. It is defined in terms of creepage and clearance distances. Factors such as voltage, application, and the type of PCB assembly play a key role in determining the minimum PCB line spacing requirements. THE BENEFITS AND CHALLENGES OF MICROELECTRONICS DESIGNS The microelectronics market is growing—fast. We’ll focus on some of the benefits and challenges of microelectronics designs. To make the most of the microelectronics space, companies must ensure they’re accommodating microelectronics’ limitations andadvantages.
PCB STACKUP PLANNER
PCB Stackup Planner. An accurate and detailed PCB stack-up at the beginning stages of a layout reduces unnecessary iterations and helps optimize the costs by increasing manufacturability and electrical performance for a given design. This tool offers precise options for cost-optimized stack-up structures and has an integrated Impedance HOW TO USE VIA-IN-PAD FOR PCB DESIGN AND MANUFACTURING Here the via is placed directly on the copper pad of a surface-mounted component and plated with copper (VIPPO), as opposed to a conventional via in which the signal carrying trace is routed away from the pad (dog-bone), to the via. A via-in-pad serves the function of miniaturizing the PCB form factor by reducing the space taken up bytrace
7 TIPS AND PCB DESIGN GUIDELINES FOR EMI AND EMC 1.1 Trace separation: All signals (clocks, video, audio, reset, etc.) must be separated from other traces. the general rule says that the separation between the traces should be 3W, where ‘W’ is the width of the trace. This practice helps to reduce crosstalk andSIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. HOW TO MASTER HIGH DENSITY INTERCONNECT PCB DESIGN HDI PCBs are printed circuit boards that feature higher wiring density per surface area than standard PCBs. HDI PCBs use some or all the below features that reduce the size of the PCB: Lines and spaces less than or equal to 100 micrometers. Vias less than or equal to 150 micrometers. Capture pads less than or equal to 400 micrometers. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
COPPER WRAP PLATING REQUIREMENT FOR PCB MANUFACTURING The IPC 6021B standard has included a copper wrap plating requirement for via-in-pad structures. The filled copper plating should continue around the edge of the via hole and extend onto the annular ring surrounding the via pad. The requirement enhances the reliability of the via plating and can potentially minimize failure due to cracks or MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. DESIGN FOR ASSEMBLY HANDBOOK Design for assembly, or DFA, is a systematic process that is used to reduce the assembly costs of a product by simplifying its design. This is done by reducing the number of components or parts in the product design and ensuring the parts are easily assembled.ANNULAR RING
Annular breakouts occur when the drilled via is not fully encircled by the pad. This can happen when the lamination process causes the PCB to shift and move away from where parts (pads, traces, etc.) should be. This is a problem when drilling, as annular breakouts can occur. Breakouts of 90 to 180 degrees can occur. A 90-degree annularbreakout.
HOW TO USE VIA-IN-PAD FOR PCB DESIGN AND MANUFACTURING Here the via is placed directly on the copper pad of a surface-mounted component and plated with copper (VIPPO), as opposed to a conventional via in which the signal carrying trace is routed away from the pad (dog-bone), to the via. A via-in-pad serves the function of miniaturizing the PCB form factor by reducing the space taken up bytrace
NIST 800-171 COMPLIANCE: A DIVERSE PROGRAM FOR PCB The NIST compliance 800-171 will help organizations to store, monitor, and exchange information securely. The proliferation of cyberterrorism has driven the need for such compliances to improve cybersecurity over the past few years. The technological innovation will likely reduce the risk associated with cyberterrorism, and data breach.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. HOW TO MASTER HIGH DENSITY INTERCONNECT PCB DESIGN HDI PCBs are printed circuit boards that feature higher wiring density per surface area than standard PCBs. HDI PCBs use some or all the below features that reduce the size of the PCB: Lines and spaces less than or equal to 100 micrometers. Vias less than or equal to 150 micrometers. Capture pads less than or equal to 400 micrometers. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. COPPER WRAP PLATING REQUIREMENT FOR PCB MANUFACTURING The IPC 6021B standard has included a copper wrap plating requirement for via-in-pad structures. The filled copper plating should continue around the edge of the via hole and extend onto the annular ring surrounding the via pad. The requirement enhances the reliability of the via plating and can potentially minimize failure due to cracks or DESIGN FOR ASSEMBLY HANDBOOK Design for assembly, or DFA, is a systematic process that is used to reduce the assembly costs of a product by simplifying its design. This is done by reducing the number of components or parts in the product design and ensuring the parts are easily assembled.ANNULAR RING
Annular breakouts occur when the drilled via is not fully encircled by the pad. This can happen when the lamination process causes the PCB to shift and move away from where parts (pads, traces, etc.) should be. This is a problem when drilling, as annular breakouts can occur. Breakouts of 90 to 180 degrees can occur. A 90-degree annularbreakout.
HOW TO USE VIA-IN-PAD FOR PCB DESIGN AND MANUFACTURING Here the via is placed directly on the copper pad of a surface-mounted component and plated with copper (VIPPO), as opposed to a conventional via in which the signal carrying trace is routed away from the pad (dog-bone), to the via. A via-in-pad serves the function of miniaturizing the PCB form factor by reducing the space taken up bytrace
NIST 800-171 COMPLIANCE: A DIVERSE PROGRAM FOR PCB The NIST compliance 800-171 will help organizations to store, monitor, and exchange information securely. The proliferation of cyberterrorism has driven the need for such compliances to improve cybersecurity over the past few years. The technological innovation will likely reduce the risk associated with cyberterrorism, and data breach.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits. PCB Fabrication, Component Procurement, and Assembly. Bundled together in an entirely-online process. Reviewed and tested by Engineers. DFA & DFM Checks on every order. Shipped from Silicon Valley in as fast as 5 days. Start Your Quote. You Dream. We Deliver. 8 DESIGN REQUIREMENTS FOR FLEX PCB To successfully design a flexible PCB, it is important for the designers to have a basic understanding of the flex drawing requirements. In this blog post, let’s take a close look at these 8 drawing requirements: Flex PCB stackup construction and layer order. Dimensional drawing and tolerances. Flex PCB materials to be used. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
ENEPIG PCB – SIERRA CIRCUITS ENEPIG . ENEPIG is a type of surface finish done on copper layer to protect it from oxidation and corrosion in printed circuit boards. This surface finish improves the solderability of HOW TO BREAKOUT A BGA: TWO EXAMPLES OF A .4MM BGA How to breakout a .4mm BGA: Example #2. This is a .4mm BGA pitch on a 6×6 matrix. It has 4-5 mil trace/space, with 4-mil lasers and 8-mil pads. The routing strategy includes stacked and staggered vias. This PCB has 4-mil vias. The material thickness between layers 1 – 2 should be 4 mils, max. THE EFFECTS OF HIGH SPEED SIGNALS IN A PCB DESIGN HOW TO ROUTE DIFFERENTIAL PAIRS IN KICAD Go to Route > click tune differential pair skew/phase > click on any of the track. When you click on the track, you can see the length of skew. Length of both tracks should be the same. If it is different, you need to increase the length of shorter track to match with thelonger track.
MILSPEC/AEROSPACE PCB FAQ Sierra Circuits, Inc. 1108 West Evelyn Avenue. Sunnyvale, CA 94086, USA. Phone: (800) 763-7503 ANNULAR RING EXPLAINED BY A PCB MANUFACTURER Annular Ring. 2:48. Annular ring provides an area for connecting leads or wires to the electronic component, which serves as an anchor for the circuit. The minimum annular ring diameter will be determined by the manufacturer’s PCB assembly capabilities which can vary based on the nature of the holes and whether or not they are plated. PCB TRACE WIDTH, CURRENT CAPACITY AND TEMPERATURE RISE Tool calculations are based on the IPC-2152. The new IPC-2152 standard is a significant improvement over the previous IPC-2221 standard. Disclaimer: Our trace width calculator tool is exclusively designed to evaluate optimum trace width, maximum trace current, and temperature rise above the ambient required for a feasible PCB design.SIERRA CIRCUITS
Sierra Circuits pays close attention to ensuring high-quality, controlled impedance, and impedance design. In fact, we created an impedance calculator so customers could check impedance levels before designing begins. Make sure all your single-ended and differential-pair impedance traces are manufacturable. Create customcalculations and
12 PCB THERMAL MANAGEMENT TECHNIQUES 2 12 PCB thermal management techniques to reduce PCB heating. 2.1 Identifying thermal hotspots and high-current traces. 2.2 Copper thickness and width of traces. 2.3 Pad design for PCB thermal management. 2.4 Placing of high power components in PCB. 2.5 PCB thermal vias design. HOW TO MASTER HIGH DENSITY INTERCONNECT PCB DESIGN HDI PCBs are printed circuit boards that feature higher wiring density per surface area than standard PCBs. HDI PCBs use some or all the below features that reduce the size of the PCB: Lines and spaces less than or equal to 100 micrometers. Vias less than or equal to 150 micrometers. Capture pads less than or equal to 400 micrometers. IPC-6012 OR IPC-A-600: WHICH STANDARD SHOULD YOU USE IPC-6012 is the specification and IPC-A-600 is the visual representation of the IPC-6012 document. They both work hand in hand. However, manufacturers like Sierra Circuits inspect their boards at their PCB assembly facility with the help of IPC-A-600. Sierra is capable of certifying to IPC-6012, IPC-6013, IPC-6015, IPC-6018, aswell as IPC-A-600.
MILITARY-GRADE PCB DESIGN RULES AND CONSIDERATIONS A military-grade printed circuit board must be designed from scratch as a military spec or IPC 6012 class 3/A. The design, layout, material selection, and fabrication processes should follow the stringent standards. These PCBs are fabricated by qualified manufacturers who are capable of working with tight parameters and tolerances. COPPER WRAP PLATING REQUIREMENT FOR PCB MANUFACTURING The IPC 6021B standard has included a copper wrap plating requirement for via-in-pad structures. The filled copper plating should continue around the edge of the via hole and extend onto the annular ring surrounding the via pad. The requirement enhances the reliability of the via plating and can potentially minimize failure due to cracks or DESIGN FOR ASSEMBLY HANDBOOK Design for assembly, or DFA, is a systematic process that is used to reduce the assembly costs of a product by simplifying its design. This is done by reducing the number of components or parts in the product design and ensuring the parts are easily assembled.ANNULAR RING
Annular breakouts occur when the drilled via is not fully encircled by the pad. This can happen when the lamination process causes the PCB to shift and move away from where parts (pads, traces, etc.) should be. This is a problem when drilling, as annular breakouts can occur. Breakouts of 90 to 180 degrees can occur. A 90-degree annularbreakout.
HOW TO USE VIA-IN-PAD FOR PCB DESIGN AND MANUFACTURING Here the via is placed directly on the copper pad of a surface-mounted component and plated with copper (VIPPO), as opposed to a conventional via in which the signal carrying trace is routed away from the pad (dog-bone), to the via. A via-in-pad serves the function of miniaturizing the PCB form factor by reducing the space taken up bytrace
NIST 800-171 COMPLIANCE: A DIVERSE PROGRAM FOR PCB The NIST compliance 800-171 will help organizations to store, monitor, and exchange information securely. The proliferation of cyberterrorism has driven the need for such compliances to improve cybersecurity over the past few years. The technological innovation will likely reduce the risk associated with cyberterrorism, and data breach.MAY 13TH, 2020
Our Silicon Valley facility is deemed "essential" and is fully operational to support medical, defense & other printed circuit board fabrication and assembly projects. For your more complex boards, please send your quote request to FILES@PROTOEXPRESS.COM. You can also quote and order standard technology PCBs/Assembly onlineon this website.
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HOW TO HANDLE CURRENT RETURN PATH FOR BETTER THE SIGNAL INTEGRITY Before we start with today’s article, something needs to get engraved in your minds. If some current goes out somewhere, it will always come back to the source, with no exceptions. Hence, there is always a current loop, a current return path along with the current-carrying traces. So, the current does not really care if you provide it that return path, it will find its own. But if you do not, it will interfere and mess around with your entire circuit, while finding its own way back.Learn More
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