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HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
CHIPLETS FOR THE MASSES Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That’s changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your systemremains uncertain.
FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip.WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This BREAKING THE 2NM BARRIER Breaking The 2nm Barrier. New interconnects and processes will be required to reach the next process nodes. February 18th, 2021 - By: Mark LaPedus. Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. EUV PELLICLES FINALLY READY When EUV was first inserted into production at 7nm in 2018, EUV pellicles weren’t ready. EUV pellicles use different and more complex materials than pellicles for optical lithography. Still, some chipmakers put EUV into production without pellicles, and THE DARKER SIDE OF HYBRID BONDING The Darker Side Of Hybrid Bonding. The approach offers huge performance gains, but pitfalls remain. December 17th, 2020 - By: Katherine Derbyshire. With semiconductors, it’s often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such asbonding two chips
EUV CHALLENGES AND UNKNOWNS AT 3NM AND BELOW November 19th, 2020 - By: Mark LaPedus. The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. FLAT-PANEL DISPLAY DEMAND SOARS Demand for PCs, TVs and other products fueled renewed growth for displays. In total, the flat-panel display market reached $118 billion in 2020, up 6% over 2019, according to DSCC. That’s above the previous 2% growth forecast. The numbers include LCDs, OLEDs and other displays. Of those figures, the LCD market reached $84 billion, whileOLEDs
HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
CHIPLETS FOR THE MASSES Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That’s changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your systemremains uncertain.
FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip.WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This BREAKING THE 2NM BARRIER Breaking The 2nm Barrier. New interconnects and processes will be required to reach the next process nodes. February 18th, 2021 - By: Mark LaPedus. Chipmakers continue to make advancements with transistor technologies at the latest process nodes, but the interconnects within these structures are struggling to keep pace. EUV PELLICLES FINALLY READY When EUV was first inserted into production at 7nm in 2018, EUV pellicles weren’t ready. EUV pellicles use different and more complex materials than pellicles for optical lithography. Still, some chipmakers put EUV into production without pellicles, and THE DARKER SIDE OF HYBRID BONDING The Darker Side Of Hybrid Bonding. The approach offers huge performance gains, but pitfalls remain. December 17th, 2020 - By: Katherine Derbyshire. With semiconductors, it’s often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such asbonding two chips
EUV CHALLENGES AND UNKNOWNS AT 3NM AND BELOW November 19th, 2020 - By: Mark LaPedus. The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks.WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This LATEST IC FORECAST: BIG DEMAND, SHORTAGES McClean: Assuming a 60% increase in spending for TSMC this year to $27.5 billion, a 37% increase for Intel to $19.5 billion and flat spending for Samsung at $28.0 billion this year, we are forecasting a total increase of 18% this year to $133.4 billion. To the best of our knowledge, Samsung has not publicly released its semiconductor capital ADVANCING 3D INTEGRATION 1 day ago · Jerry Tzou’s recent presentation on 3D Fabric Technology was all about More than Moore. TSMC has other specialized technologies such as RF and eNVM, but this is a general foundational technology for hyperscale data centers, mobile, and AI. Jerry started with the motivation for WEEK IN REVIEW: MANUFACTURING, TEST 4 hours ago · IBM has filed suit against GlobalFoundries (GF), alleging fraud and breach of contract committed by GF. IBM’s suit, filed in the Supreme Court of the state of New York, seeks relief and punitive damages. In 2015, GF completed a deal to acquire IBM’s loss CUSTOMIZING CHIPS FOR POWER AND PERFORMANCE 1 day ago · Cerato: There is an evolution of the products that we are making or that we have to design. It doesn’t matter whether you’re doing a sensor, or just the computing part of a sensor, or whether that’s connected to the cloud or the edge.You need to know all three of these, because if you change something in any of these it affects the functionality of all of them.BLOG REVIEW: JUN 9
Arm’s Partha Maji introduces a collaboration with the University of Cambridge to advance Bayesian statistics and probabilistic machine learning, which could play a vital role in safety-critical AI applications. Siemens’ Thomas Dewey looks at a way to improve autonomous driving capabilities by WHERE IMPERFECTIONS LEAD TO OPPORTUNITY Evelyn Hu Evelyn Hu is an IEEE Life Fellow and fellow of the American Academy of Arts and Sciences. She is the Tarr-Coyne Professor of Applied Physics and Electrical Engineering at the John A. Paulson School of Engineering and Applied Sciences at Harvard University, and was awarded the 2021 IEEE/RSE James Clerk Maxwell Medal for leadership in nanoscale science and engineering, and for THERMAL FLOORPLANNING FOR CHIPS 1 day ago · Heat management is becoming crucial to an increasing number of chips, and it’s one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating WHAT’S AFTER CMOS? What’s After CMOS? There are more than 20 possible successors; carbon nanotubes, graphene and 3D devices are way down on the list. January 24th, 2014 - By: Mark LaPedus. Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor couldscale at
MICHAEL EBLI, AUTHOR AT SEMICONDUCTOR ENGINEERING The automation engineers of the 1960s would look with envy at the servo technology in use today. Small, precise, and, above all, electric, they are a reflection of the compactness of the semiconductor control, sensor, and power technology we have SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. PPA (POWER, PERFORMANCE, AREA) PPA stands for power, performance and area, and historically these have been the three variables used in deciding how to optimize semiconductor designs. Until 65nm, cost, which is a function of area, and performance, were the most-cited criteria for a successful design. But as battery-driven mobile devices have replaced PCs as the volume platform for » read more THE GOOD AND BAD OF AUTO IC UPDATES The Good And Bad Of Auto IC Updates. Complex electronics and longer lifetimes will require much tighter supply chain management. June 3rd, 2021 - By: John Koon. Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of thosedevices are
PROBLEMS AND SOLUTIONS IN ANALOG DESIGN Problems And Solutions In Analog Design. At 7nm and beyond, and in many advanced packages, all devices are subject to noise and proximity effects. August 5th, 2020 - By: Ann Steffora Mutschler. Advanced chip design is becoming a great equalizer for analog and digital at each new node. Analog IP has more digital circuitry, and digital designs CHIPLETS FOR THE MASSES Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That’s changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your systemremains uncertain.
HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This LATEST IC FORECAST: BIG DEMAND, SHORTAGES McClean: Assuming a 60% increase in spending for TSMC this year to $27.5 billion, a 37% increase for Intel to $19.5 billion and flat spending for Samsung at $28.0 billion this year, we are forecasting a total increase of 18% this year to $133.4 billion. To the best of our knowledge, Samsung has not publicly released its semiconductor capital WEEK IN REVIEW: DESIGN, LOW POWER Week In Review: Design, Low Power. Arm details new platforms, interconnect; accelerating data center workloads; SiC MOSFET SPICE model. Arm released new details on its new Neoverse N2 and Neoverse V1 platforms. A range of companies announced they will be using the platforms, including Marvell and SiPearl. Aimed at server and HPCworkloads
SEMICONDUCTOR ENGINEERING Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors. FROM FINFETS TO GATE-ALL-AROUND From FinFETs To Gate-All-Around. FinFETs are reaching the end of their utility as challenges mount at the 5- and 3-nm nodes, but new transistor types are on the horizon. When they were first commercialized at the 22 nm node, finFETs represented a revolutionary change to the way we build transistors, the tiny switches in the “brains” of a chip. PPA (POWER, PERFORMANCE, AREA) PPA stands for power, performance and area, and historically these have been the three variables used in deciding how to optimize semiconductor designs. Until 65nm, cost, which is a function of area, and performance, were the most-cited criteria for a successful design. But as battery-driven mobile devices have replaced PCs as the volume platform for » read more THE GOOD AND BAD OF AUTO IC UPDATES The Good And Bad Of Auto IC Updates. Complex electronics and longer lifetimes will require much tighter supply chain management. June 3rd, 2021 - By: John Koon. Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of thosedevices are
PROBLEMS AND SOLUTIONS IN ANALOG DESIGN Problems And Solutions In Analog Design. At 7nm and beyond, and in many advanced packages, all devices are subject to noise and proximity effects. August 5th, 2020 - By: Ann Steffora Mutschler. Advanced chip design is becoming a great equalizer for analog and digital at each new node. Analog IP has more digital circuitry, and digital designs CHIPLETS FOR THE MASSES Chiplets are a compelling technology, but so far they are available only to a select few players in the industry. That’s changing, and the industry has taken little steps to get there, but timing for when you will be able to buy a chiplet to integrate into your systemremains uncertain.
HOW DO MACHINES LEARN? Conclusion. As a summary, machines learn by being trained with high-quality labeled data that embody a good representation of the target classes. Subsequently, what determines the accessibility of a machine learning system is how to make it easy to organize data (defect images, for example), to pre-process them, to label them, topresent them
WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This LATEST IC FORECAST: BIG DEMAND, SHORTAGES McClean: Assuming a 60% increase in spending for TSMC this year to $27.5 billion, a 37% increase for Intel to $19.5 billion and flat spending for Samsung at $28.0 billion this year, we are forecasting a total increase of 18% this year to $133.4 billion. To the best of our knowledge, Samsung has not publicly released its semiconductor capital WEEK IN REVIEW: DESIGN, LOW POWER Week In Review: Design, Low Power. Arm details new platforms, interconnect; accelerating data center workloads; SiC MOSFET SPICE model. Arm released new details on its new Neoverse N2 and Neoverse V1 platforms. A range of companies announced they will be using the platforms, including Marvell and SiPearl. Aimed at server and HPCworkloads
SEMICONDUCTOR CAPEX TO GROW 13.0% IN 2021 Semiconductor CapEx To Grow 13.0% In 2021. Total market to reach $127B this year; Samsung, TSMC are top spenders. Semiconductor capital expenditures grew 9.2% in 2020 to US$112.1 billion. This is $14.1 billion higher than our spring 2020 forecast, and $3.2 billion higher than our fall 2020 forecast. As shown in the graph below, the total2020
WHAT'S AFTER 5G
What’s After 5G. The path to 6G will require some radical changes to both infrastructure and use models. This year’s IEEE Symposia on VLSI Technology and Circuits (VLSI 2020) included a presentation by NTT Docomo that looked far into the future of cellular communications, setting the stage for a broad industry shift in communication. This FEARLESS CHIP FORECASTS FOR 2021 McClean: For 2021, we have the IC market increasing 12% to $441.5 billion and the O-S-D (optoelectronics, sensors/actuators, and discretes) market increasing 8% to $92.1 billion. The total semi market is forecast to increase 11% this year to $533.6 billion. In 2020, the IC market increased 10%, the O-S-D market dropped by 1%, andthe total semi
ALL ABOUT INTERCONNECTS Global interconnects are higher up in the structure; they travel between different blocks of the circuit and are thus typically thick, long, and widely separated. Connections between interconnect levels, called vias, allow signals and power to be transmitted from one layer to the next. Interconnect Materials. For decades, aluminuminterconnects
PRIMARY, ANONYMOUS, OR WHAT? Top level primary I/Os remain mysterious in the verification world, specifically when you consider UPF-based low power designs. In real silicon, they are usually driven by off-chip supplies; however, verification complications are multifold for RTL and gate level simulations of them. This paperBLOG REVIEW: JUN 9
5 hours ago · Arm’s Partha Maji introduces a collaboration with the University of Cambridge to advance Bayesian statistics and probabilistic machine learning, which could play a vital role in safety-critical AI applications. Siemens’ Thomas Dewey looks at a way to improve autonomous driving capabilities by FLAT-PANEL DISPLAY DEMAND SOARS Demand for PCs, TVs and other products fueled renewed growth for displays. In total, the flat-panel display market reached $118 billion in 2020, up 6% over 2019, according to DSCC. That’s above the previous 2% growth forecast. The numbers include LCDs, OLEDs and other displays. Of those figures, the LCD market reached $84 billion, whileOLEDs
WHERE IMPERFECTIONS LEAD TO OPPORTUNITY Evelyn Hu Evelyn Hu is an IEEE Life Fellow and fellow of the American Academy of Arts and Sciences. She is the Tarr-Coyne Professor of Applied Physics and Electrical Engineering at the John A. Paulson School of Engineering and Applied Sciences at Harvard University, and was awarded the 2021 IEEE/RSE James Clerk Maxwell Medal for leadership in nanoscale science and engineering, and forEDA IN THE CLOUD
Hagai Arbel, CEO of Vtool, talks with Semiconductor Engineering about the benefits of moving EDA tools to the cloud, why it has been slow to take off, and what will drive this trend in the future. KOJI MIYAUCHI, AUTHOR AT SEMICONDUCTOR ENGINEERING In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-inSubmit__
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SPECIAL REPORTS
New Security Risks Create Need For Stealthy ChipsBy: Ed Sperling
Thinner dies and insulation layers add vulnerabilities for better hacker tools. Solutio... Solving The Memory BottleneckBy: Brian Bailey
Moving large amounts of data around a system is no longer the path to success. It is to... The Race To Next-Gen 2.5D/3D PackagesBy: Mark LaPedus
New approaches aim to drive down cost, boost benefits of heterogeneousintegration.
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TOP STORIES
WHY EV BATTERY DESIGN IS SO DIFFICULT Classic automotive design in a silo no longer works for cars that operate as electronic... October 3rd, 2019 By ANN STEFFORA MUTSCHLER ML, EDGE DRIVE IP TO OUTPERFORM BROADER CHIP MARKET New applications, architectures and customer base provide continuous stream of opportun... October 3rd, 2019 By KEVIN FOGARTY OVER $7 BILLION RAISED IN MEGA-ROUNDS BY 27 FIRMS September was spectacular for startups, as 27 tech companies raised $100 million or mor... October 2nd, 2019 By JEFF DORSCH SECURITY TRADEOFFS IN A SHIFTING GLOBAL SUPPLY CHAIN How many simulation cycles are needed to crack an AES key? Plus, the impact of trade wa... September 30th, 2019 By ED SPERLING OPEN ISAS GAINING TRACTION Emphasis on flexibility, time to market and heterogeneity requires more processing opti... September 26th, 2019 By ANN STEFFORA MUTSCHLER THE GROWING IMPACT OF PORTABLE STIMULUS Experts at the Table: How the Portable Test and Stimulus Standard has affected the indu... September 26th, 2019 By BRIAN BAILEY WHY DATA IS SO DIFFICULT TO PROTECT IN AI CHIPS AI systems are designed to move data through at high speed, not limit access. That crea... September 25th, 2019 By ED SPERLING CHALLENGES GROW FOR FINDING CHIP DEFECTS Costs are rising, and so is the time it takes to inspect a wafer. September 19th, 2019 By MARK LAPEDUS MAGNETIC MEMORIES REACH FOR CENTER STAGE Why MRAM technology works best for connected devices. September 19th, 2019 By KATHERINE DERBYSHIRE USING MACHINE LEARNING IN FABS ML will augment existing manufacturing processes, but it won'treplace them.
September 19th, 2019 By MARK LAPEDUS WHY DRAM WON’T GO AWAY New materials, new architectures and higher density have limited what can be done with ... September 18th, 2019 By ED SPERLING EDA REVENUE UP 6.6% FOR Q2 AI, automotive and design activity by systems companies continue to drive EDA industry ... September 17th, 2019 By ANN STEFFORA MUTSCHLERmore top stories »
LATEST NEWS
WEEK IN REVIEW: MANUFACTURING, TEST Fan-out deal; 5G test; Huawei’s chip vendors. October 4th, 2019 By MARK LAPEDUS WEEK IN REVIEW: DESIGN, LOW POWER Signoff closure; PCB design reviews; Xilinx tool; embedded vis... October 4th, 2019 By JESSE ALLEN WEEK IN REVIEW – IOT, SECURITY,... Cadence teams with Adesto on IoT; Synopsys PrimeECO; UPS drone... October 4th, 2019 By JEFF DORSCHBLOG REVIEW: OCT. 2
Finite element analysis; false claims; HPC utilization. October 2nd, 2019 By JESSE ALLENmore news »
RESEARCH
MANUFACTURING BITS: OCT. 1 3D balloon printing; printed turbines; CAD tools.By MARK LAPEDUS
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OVER $7 BILLION RAISED IN MEGA-RO... September was spectacular for startups, as 27 tech companies r...By JEFF DORSCH
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STOCK MARKET NEWS
NAME
SYMBOL
PRICE
CHANGE
% CHANGE
Advanced Micro Devices, Inc.AMD
$ 29.01
__ 0.33
__ 1.15%
ANSYS, Inc.
ANSS
$ 224.63
__ 4.39
__ 1.99%
Applied Materials, Inc.AMAT
$ 50.88
__ 1.24
__ 2.50%
ASE Technology Holding Co., Ltd.ASX
$ 4.70
__ 0.06
__ 1.29%
ASML Holding N.V.
ASML
$ 246.04
__ 1.69
__ 0.69%
Cadence Design Systems, Inc.CDNS
$ 65.91
__ 0.81
__ 1.24%
Intel Corporation
INTC
$ 50.92
__ 0.89
__ 1.78%
KLA Corporation
KLAC
$ 161.11
__ 4.15
__ 2.64%
Lam Research CorporationLRCX
$ 233.27
__ 4.22
__ 1.84%
National Instruments CorporationNATI
$ 40.53
__ 0.38
__ 0.95%
Rambus Inc.
RMBS
$ 13.06
__ 0.15
__ 1.16%
Synopsys, Inc.
SNPS
$ 138.78
__ 2.75
__ 2.02%
Taiwan Semiconductor Manufacturing Company LimitedTSM
$ 47.42
__ 0.29
__ 0.62%
United Microelectronics CorporationUMC
$ 2.13
__ 0.03
__ 1.43%
Veeco Instruments Inc.VECO
$ 11.49
__ 0.32
__ 2.86%
Source: Premium Stock Market Widgets DISCLAIMER:_Semiconductor Engineering/Sperling Media Group LLC expressly disclaims the adequacy, accuracy, or completeness of any data and shall not be liable for any errors, omissions or other faults in, delays or interruptions in such data, or for any actions taken inreliance thereon._
VIDEOS
MEMORY SUBSYSTEMS IN EDGE INFERENCING CHIPS September 23rd, 2019 THE NEW CXL STANDARD September 15th, 2019 IMPROVING QUALITY THROUGH DATA ANALYTICS September 11th, 2019 ENSURING A 5G DESIGN IS VIABLESeptember 9th, 2019
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BUSINESS
SIEMENS TO BUY MENTOR FOR $4.5B Updated: Deal adds mechanical, thermal, electrical and embedde... November 14th, 2016 By ED SPERLING SAMSUNG TO BUY HARMAN FOR $8B Tier 1 acquisition boosts automotive portfolio. November 14th, 2016 By ANN STEFFORA MUTSCHLER QUALCOMM + NXP = IOT POWERHOUSE What the Qualcomm-NXP deal means for IoT. November 3rd, 2016 By JEFF DORSCH LAM, KLA-TENCOR SCRAP MERGER Updated: Regulatory issues plague M&A activity in fab tool bus... October 5th, 2016 By MARK LAPEDUSmore Business »
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ED SPERLING
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Technology Editor
ANN STEFFORA MUTSCHLER Executive Editor/EDABRIAN BAILEY
Technology Editor/EDAJESSE ALLEN
Senior Editor/KC AdministratorKEVIN FOGARTY
MARK LAPEDUS
Executive Editor/ ManufacturingSUSAN RAMBO
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