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CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more CONVERGENCE ENHANCED MULTIMEDIA MSM6125™ CHIPSET … The QUALCOMM® Multimedia Platform has been specifically designed to drive the rapid development and adoption of high-speed wireless data applications. It offers a system and software solution that enables video, audio, gaming and location-based products and services fortoday’s handsets.
INFO_OS – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right to MARC4 4 BIT MICROCONTROLLER PROGRAMMER’S GUIDE MARC4 Programmer’s Guide Hardware Description TELEFUNKEN Semiconductors 8 Rev. A 07/94 1. MARC4 architecture 1.1 General description The MARC4 microcontroller consists of an 5NM – WIKICHIP FUSE 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more CONVERGENCE ENHANCED MULTIMEDIA MSM6125™ CHIPSET … The QUALCOMM® Multimedia Platform has been specifically designed to drive the rapid development and adoption of high-speed wireless data applications. It offers a system and software solution that enables video, audio, gaming and location-based products and services fortoday’s handsets.
INFO_OS – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right to MARC4 4 BIT MICROCONTROLLER PROGRAMMER’S GUIDE MARC4 Programmer’s Guide Hardware Description TELEFUNKEN Semiconductors 8 Rev. A 07/94 1. MARC4 architecture 1.1 General description The MARC4 microcontroller consists of an 5NM – WIKICHIP FUSE 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year. AMD 3D STACKS SRAM BUMPLESSLY SoIC. The disclosed information implies AMD will be utilizing TSMC’s System on Integrated Chips (SoIC) technology. SoIC is an umbrella brand term used by TSMC to describe a whole set of back-end 3D stacking packaging technologies which, in turn, can be holistically integrated into any other front-end technology such as flip-chip (as in the case of AMD), CoWoS, or InFO.POWER MANAGEMENT
WikiChip is an independent publisher based in New York. The WikiChip Fuse section publishes chips and semiconductor related news with our main site offering in-depth semiconductor resources and analysis. AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM INFO_OS – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
FOUNDRIES – WIKICHIP FUSE TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon. ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. EUV – WIKICHIP FUSE ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. N7 – WIKICHIP FUSE TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon. CMN-700 – WIKICHIP FUSE Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of 5NM – WIKICHIP FUSE 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year.CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 5NM – WIKICHIP FUSE January 17, 2020. May 25, 2021. David Schor 3nm, 5nm, 7nm, N3, N5, N6, N7, TSMC. 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year. Read more. AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM ADVANCED INTERFACE BUS (AIB) November 7, 2019. May 25, 2021. David Schor 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10. Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology. 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toCORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 5NM – WIKICHIP FUSE January 17, 2020. May 25, 2021. David Schor 3nm, 5nm, 7nm, N3, N5, N6, N7, TSMC. 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year. Read more. AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM ADVANCED INTERFACE BUS (AIB) November 7, 2019. May 25, 2021. David Schor 14 nm, 2.5D packaging, Advanced Interface Bus (AIB), Data Interface Bus (DIB), EMIB, FPGA, Intel, multi-chip package, Stratix 10. Intel launches the industry’s highest-capacity FPGA; 10-million LEs comprising two large FPGA dies interconnected using the company’s 2.5D EMIB packaging technology. 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toPOWER MANAGEMENT
WikiChip is an independent publisher based in New York. The WikiChip Fuse section publishes chips and semiconductor related news with our main site offering in-depth semiconductor resources and analysis. SYSTEM ON INTEGRATED CHIPS (SOIC) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
AMD ATHLON XP PROCESSOR MODEL 10 DATA SHEET Preliminary Information AMD Athlon XP Processor Model 10 Data Sheet Publication # 26237 Rev. C Issue Date: May 2003 TM EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. 5NM – WIKICHIP FUSE January 17, 2020. May 25, 2021. David Schor 3nm, 5nm, 7nm, N3, N5, N6, N7, TSMC. 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the 6-nanometer by the end of the year. Read more. N7 – WIKICHIP FUSE April 17, 2020. May 25, 2021. David Schor 3 nm, 5 nm, FinFET, N3, N5, N5P, N7, N7P, TSMC. TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of INFO_OS – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. TSMC – WIKICHIP FUSE TSMC Q4: 7nm Dominates Revenue, Preps 5nm Ramp, 6nm By EOY. January 17, 2020 David Schor 3nm, 5nm, 7nm, N3, N5, N6, N7, TSMC. 7-nanometer contributes the lion’s share of wafer revenue to TSMC’s fourth-quarter driven by growth from smartphones and HPC. The foundry is also preparing the 5-nanometer node for early this year and the6-nanometer
CMN-700 – WIKICHIP FUSE Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens ofCORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores INTEL XEON PROCESSOR D-1500 PRODUCT FAMILY Product rief Intel® Xeon® Processor D-1500 Product amily 4 OS VENDORS OPERATING SYSTEM SUPPORT (64B) DISTRIBUTION SUPPORT BIOS VENDORS Microsoft Windows* Server 2016 Microsoft Intel/Microsoft American Megatrends Inc. Insyde Software Phoenix Technologies BYOSOFT CMN-700 – WIKICHIP FUSE The Mesh Network For Next-Generation Neoverse Chips. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators,chiplets, and
CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores INTEL XEON PROCESSOR D-1500 PRODUCT FAMILY Product rief Intel® Xeon® Processor D-1500 Product amily 4 OS VENDORS OPERATING SYSTEM SUPPORT (64B) DISTRIBUTION SUPPORT BIOS VENDORS Microsoft Windows* Server 2016 Microsoft Intel/Microsoft American Megatrends Inc. Insyde Software Phoenix Technologies BYOSOFT CMN-700 – WIKICHIP FUSE The Mesh Network For Next-Generation Neoverse Chips. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators,chiplets, and
SYSTEM ON INTEGRATED CHIPS (SOIC) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. 3D V-CACHE – WIKICHIP FUSE AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. DIRECT BOND INTERCONNECT (DBI) AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. CORTEX-X2 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
POWER MANAGEMENT
Asd says: A popup asked me to comment, so here's a comment! The Magnets Under the Icy Lake. May 23, 2021 May 23, 2021 David Schor. The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021 May 23, 2021 David Schor. Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year.11 GENERATION CORE
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. N7 – WIKICHIP FUSE April 17, 2020. May 25, 2021. David Schor 3 nm, 5 nm, FinFET, N3, N5, N5P, N7, N7P, TSMC. TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square ofDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many coresCORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores INTEL XEON PROCESSOR D-1500 PRODUCT FAMILY Product rief Intel® Xeon® Processor D-1500 Product amily 4 OS VENDORS OPERATING SYSTEM SUPPORT (64B) DISTRIBUTION SUPPORT BIOS VENDORS Microsoft Windows* Server 2016 Microsoft Intel/Microsoft American Megatrends Inc. Insyde Software Phoenix Technologies BYOSOFT CMN-700 – WIKICHIP FUSE The Mesh Network For Next-Generation Neoverse Chips. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators,chiplets, and
CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
PIC SERIES MICROCOMPUTER DATA MANUAL 1 INTRODUCTION 1.1 Dt~scription 1.2 Features The General Instrument PIC Family is a series of MOS/LSI8-bit micro computers manufactured to meet the requirements of the cost ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. AMD-K5 PROCESSOR DATA SHEET This document contains information on a product under development at AMD. The information is intended to help you evaluate this product. AMD reserves the right toDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores INTEL XEON PROCESSOR D-1500 PRODUCT FAMILY Product rief Intel® Xeon® Processor D-1500 Product amily 4 OS VENDORS OPERATING SYSTEM SUPPORT (64B) DISTRIBUTION SUPPORT BIOS VENDORS Microsoft Windows* Server 2016 Microsoft Intel/Microsoft American Megatrends Inc. Insyde Software Phoenix Technologies BYOSOFT CMN-700 – WIKICHIP FUSE The Mesh Network For Next-Generation Neoverse Chips. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators,chiplets, and
SYSTEM ON INTEGRATED CHIPS (SOIC) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. 3D V-CACHE – WIKICHIP FUSE AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. DIRECT BOND INTERCONNECT (DBI) AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. CORTEX-X2 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
POWER MANAGEMENT
Asd says: A popup asked me to comment, so here's a comment! The Magnets Under the Icy Lake. May 23, 2021 May 23, 2021 David Schor. The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021 May 23, 2021 David Schor. Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year.11 GENERATION CORE
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. N7 – WIKICHIP FUSE April 17, 2020. May 25, 2021. David Schor 3 nm, 5 nm, FinFET, N3, N5, N5P, N7, N7P, TSMC. TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square ofDAVID SCHOR
The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021. May 23, 2021. David Schor ARM, CMN-600, CMN-700, DDR5, mesh interconnect, neoverse, Neoverse N, Neoverse V, PCIe 5.0. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many coresCORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
N7 – WIKICHIP FUSE April 17, 2020. May 25, 2021. David Schor 3 nm, 5 nm, FinFET, N3, N5, N5P, N7, N7P, TSMC. TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more TESLA – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a Z15 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
XEON D – WIKICHIP FUSE The 2,048-core PEZY-SC2 sets a Green500 record. PEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s. BUNCH OF WIRES (BOW) A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposersand bridges.
ADVANCED INTERFACE BUS (AIB) Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures. July 24, 2018 David Schor Advanced Interface Bus (AIB), DARPA, EMIB, Intel, interconnects, Packaging. At the DARPA 2018 ERI Summit, Intel announced their contribution of a royalty-free bus standard to DARPA’s CHIPSProgram, allowing
CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
N7 – WIKICHIP FUSE April 17, 2020. May 25, 2021. David Schor 3 nm, 5 nm, FinFET, N3, N5, N5P, N7, N7P, TSMC. TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE January 22, 2020. May 25, 2021. David Schor ASML, EUV, High-NA, NXE:3400B, NXE:3400C. ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more TESLA – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a Z15 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
XEON D – WIKICHIP FUSE The 2,048-core PEZY-SC2 sets a Green500 record. PEZY-SC2 is PEZY’s newest 16nm a many-core processor featuring 2,048 cores that is powering the world’s most power-efficient supercomputer. The chip is the first to use a unique 3D packaging interconnect technology known as TCI in order to achieve a memory bandwidth of over 2 TB/s. BUNCH OF WIRES (BOW) A look at a Bunch of Wires, a new open standard chiplets interconnect being proposed by the OCP ODSA group intended for standard organic multi-chip packages as a cheaper alternative to silicon interposersand bridges.
ADVANCED INTERFACE BUS (AIB) Intel Opens AIB for DARPA’s CHIPS Program as a Royalty-Free Interconnect Standard for Chiplet Architectures. July 24, 2018 David Schor Advanced Interface Bus (AIB), DARPA, EMIB, Intel, interconnects, Packaging. At the DARPA 2018 ERI Summit, Intel announced their contribution of a royalty-free bus standard to DARPA’s CHIPSProgram, allowing
SYSTEM ON INTEGRATED CHIPS (SOIC) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
WIKICHIP FUSE
The Mesh Network For Next-Generation Neoverse Chips. Arm’s CMN-700 is the company’s latest high-performance cache-coherent mesh interconnect for the server market, enabling SoC designs with twice as many cores, as much as half a GiB of cache, dozens of memory controllers, and support dozens of cache-coherent accelerators,chiplets, and
DIRECT BOND INTERCONNECT (DBI) AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. 3D V-CACHE – WIKICHIP FUSE AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.POWER MANAGEMENT
Asd says: A popup asked me to comment, so here's a comment! The Magnets Under the Icy Lake. May 23, 2021 May 23, 2021 David Schor. The Mesh Network For Next-Generation Neoverse Chips. May 22, 2021 May 23, 2021 David Schor. Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year. SCALABLE VECTOR EXTENSION 2 (SVE2) April 27, 2021. May 23, 2021. David Schor ARM, ARMv9, bfloat16, Neoverse N, Neoverse V, Perseus, Scalable Vector Extension (SVE), Scalable Vector Extension 2 (SVE2), Zeus. Arm launches its next-generation server CPUs – Neoverse N2 and Neoverse V1 (formerly Perseus and Zeus). Targeting high-performance servers and the HPC market, the new cores11 GENERATION CORE
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
OPENPOWER SUMMIT
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X2 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
OPENPOWER SUMMIT
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
N7 – WIKICHIP FUSE TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more Z15 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. XEON D – WIKICHIP FUSE Intel is launching their next-generation data center infrastructure product portfolio including Cascade Lake with up to 56 cores, new lower-power Hewitt Lake processors, Optane DC SSD and persistent memory DIMMs, as well as 100 Gb Ethernet. ADVANCED INTERFACE BUS (AIB) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
CORTEX-A710
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DSU-110 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
OPENPOWER SUMMIT
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
N7 – WIKICHIP FUSE TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon. CORTEX-X1 – WIKICHIP FUSE Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. Read more Z15 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
EUV – WIKICHIP FUSE ASML saw a strong fourth-quarter in 2019 thanks to a large EUV shipment with the production of NXE:3400C machines ramping up. ASML shipped a total of 26 EUV machines in 2019 and with 35 machines expected for 2020, however, backlog continues to grow. 2ND GENERATION INTEL CORE™ PROCESSOR FAMILY MOBILE WITH ECC Specification Addenda Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 5 1 Specification Addenda 1.1 5BRelated Documents Refer to the documents in the tables below for additional information. XEON D – WIKICHIP FUSE Intel is launching their next-generation data center infrastructure product portfolio including Cascade Lake with up to 56 cores, new lower-power Hewitt Lake processors, Optane DC SSD and persistent memory DIMMs, as well as 100 Gb Ethernet. ADVANCED INTERFACE BUS (AIB) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
WIKICHIP FUSE
Your Chips and Semi News. Samsung Details 5nm and 4nm; Adds 8LPA, 5LPP, and 4LPP Nodes; Readies 3nm GAA For Next Year Hot Chips 33 Program: Alder Lake, Sapphire Rapids, Zen 3, Next-Gen Z, Neoverse N2, And Many More IBM Releases Power ISA v3.1; To Present POWER10 At Hot Chips 32 A Look at Intel Lakefield: A 3D-Stacked Single-ISA Heterogeneous Penta-Core SoC TSMC Details 5 nm SYSTEM ON INTEGRATED CHIPS (SOIC) Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
DIRECT BOND INTERCONNECT (DBI) AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density. 3D V-CACHE – WIKICHIP FUSE AMD recently unveiled 3D V-Cache, their first 3D-stacked technology-based product. Leapfrogging contemporary 3D bonding technologies, AMD jumped directly into advanced packaging with direct bonding and an order of magnitude higher wire density.POWER MANAGEMENT
WikiChip is an independent publisher based in New York. The WikiChip Fuse section publishes chips and semiconductor related news with our main site offering in-depth semiconductor resources and analysis.OPENPOWER SUMMIT
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
11 GENERATION CORE
Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
ET-MAXION – WIKICHIP FUSE A look at Esperanto’s ET-SoC-1, the startup’s first AI inference accelerator for the data center. The company took a unique RISC-V approach with a massively multi-core chip with nearly 1,100 custom-designed CPU cores. CORTEX-X2 – WIKICHIP FUSE Intel launches its 3rd Generation Xeon Scalable, formerly Ice Lake. Fabricated on the company’s 10nm process, those server chips go up to 40 Sunny Cove cores and offer a 20% IPC improvement over the priorgeneration.
SAMSUNG DETAILS 5NM AND 4NM; ADDS 8LPA, 5LPP, AND 4LPP Over the past few years, Samsung Foundry has been putting considerable effort into expanding its foundry offering. The company is pouring significant investment in an effort to win customers from its rivalfoundry, TSMC.
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LATEST COVERAGE:
ARM UPDATES ITS NEOVERSE ROADMAP: NEW BFLOAT16, SVE SUPPORTSep 22, 2020
Arm updates its Neoverse roadmap with the Neoverse N2 and V1, introducing SVE support for the first time as well as bfloat16 operations. Like the Cortex-X series, the Neoverse V-series will ease its power and area constraints in favor of higher performance. THE X86 ADVANCED MATRIX EXTENSION (AMX) BRINGS MATRIX OPERATIONS; TO DEBUT WITH SAPPHIRE RAPIDSJun 29, 2020
Intel publishes details of its upcoming Advanced Matrix Extension (AMX), an x86 extension set to debut with Sapphire Rapids that introduces a new matrix register file and accompanying matrixoperations.
ARM’S NEW CORTEX-M55 BREATHES HELIUMJun 20, 2020
A look at the new Cortex-M55, an embedded ARMv8 core with the new Helium vector extension. INTEL LAUNCHES LAKEFIELD: AN EXPERIMENT WITH MULTIPLE NEW TECHNOLOGIESJun 15, 2020
Intel launches Lakefield, a 3D SoC with a new form factor for ultra-mobile devices. This microprocessor allows the chip giant to dabble with a number of new complementary technologies that could potentially find broader uses in the future. ARM UNVEILS THE CORTEX-A78: WHEN LESS IS MOREMay 26, 2020
Arm unveils the Cortex-A78 microarchitecture for next-generation flagship smartphones. ARM CORTEX-X1: THE FIRST FROM THE CORTEX-X CUSTOM PROGRAMMay 26, 2020
Arm launches the Cortex-X1, their most powerful Cortex CPU to date. This is the first CPU from the new Cortex-X Custom Program. IBM RELEASES POWER ISA V3.1; TO PRESENT POWER10 AT HOT CHIPS 32May 23, 2020
IBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32. LEFT, RIGHT, ABOVE, AND UNDER: INTEL 3D PACKAGING TECH GAINSOMNIDIRECTIONALITY
May 17, 2020
A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits ofthermal & power.
NEC READIES 2ND GEN VECTOR ENGINEMay 15, 2020
NEC readies 2nd-generation Vector Engine, Type 20, offering higher memory bandwidth and a few more vector cores. TSMC TO BUILD A 5-NANOMETER FAB IN ARIZONA; INVEST $12B OVER THE NEXT8 YEARS
May 14, 2020
TSMC announces its intention to build and operate an advanced 5-nanometer fab in Arizona. INTEL LAUNCHES 10TH GEN COMET LAKE VPRO PROCESSORSMay 13, 2020
Intel launches its 10th-generation Comet Lake-based vPro processors. INTEL LAUNCHES ENTRY-LEVEL COMET LAKE XEON WSMay 13, 2020
Intel launches a new series of Xeon W processors for entry-level workstations based on Comet Lake. AMD LAUNCHES RYZEN PRO 4000 SERIESMay 07, 2020
AMD launches its Zen 2-based Ryzen Pro 4000 series for enterprisecustomers.
INTEL LAUNCHES 10TH GEN COMET LAKE DESKTOP PROCESSORSApr 30, 2020
Intel launches 10th Generation Core desktop processors, formerly codename Comet Lake. The new lineup brings 22 new chips with up to 10 cores and 20 threads with turbo frequencies of up to 5.3 GHz. TSMC RAMPS 5NM, DISCLOSES 3NM TO PACK OVER A QUARTER-BILLION TRANSISTORS PER SQUARE MILLIMETERApr 17, 2020
TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.See more...
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_Statistics for month of June, 2019._ Recent & Future Chips ■ Apple Mx M1 (8/8) ■ AMD Ryzen 9 Ryzen 9 5950X (16/32) @3.4 GHz
3,400 MHz
3,400,000 kHz
■ AMD Ryzen 9 Ryzen 9 5900X (12/24) @3.7 GHz
3,700 MHz
3,700,000 kHz
■ AMD Ryzen 7 Ryzen 7 5800X (8/16) @3.8 GHz
3,800 MHz
3,800,000 kHz
■ AMD Ryzen 5 Ryzen 5 5600X (6/12) @3.7 GHz
3,700 MHz
3,700,000 kHz
■ Intel Core i3 i3-8120T (4/4) @3.2 GHz
3,200 MHz
3,200,000 kHz
■ Intel Core i7 i7-8670T (6/12) ■ Intel Xeon Platinum 8170F(26/52) @ 2.1 GHz
2,100 MHz
2,100,000 kHz
■ Intel Core i3 i3-7310U (2/4) @2.7 GHz
2,700 MHz
2,700,000 kHz
■ Intel Core i3 i3-8020T (4/4) ■ AMD Ryzen 7 PRO 1700 (8/16) @3 GHz
3,000 MHz
3,000,000 kHz
■ Intel Core i3 i3-8130U (2/4) @2.2 GHz
2,200 MHz
2,200,000 kHz
■ AMD Ryzen 3 PRO 1200 (4/4) @3.1 GHz
3,100 MHz
3,100,000 kHz
■ Intel Core i9 i9-7920X(12/24) @ 2.9 GHz
2,900 MHz
2,900,000 kHz
■ Intel Xeon Platinum 8173M(28/56) @ 2.1 GHz
2,100 MHz
2,100,000 kHz
■ Intel Core i5 i5-8250U (4/8) @1.6 GHz
1,600 MHz
1,600,000 kHz
■ Intel Core i5 i5-8350U (4/8) @1.7 GHz
1,700 MHz
1,700,000 kHz
■ Qualcomm, ARM Holdings Snapdragon 600 SM6125(8/8) @ 2 GHz
2,000 MHz
2,000,000 kHz
, 1.8 GHz
1,800 MHz
1,800,000 kHz
■ Xiaomi, ARM Holdings Surge S2 (8/8) ■ Intel Xeon W W-2102 (4/4) @2.9 GHz
2,900 MHz
2,900,000 kHz
■ Intel Core i3 i3-9000 (4/4) @3.7 GHz
3,700 MHz
3,700,000 kHz
■ Intel Xeon Gold 6161 (22/44) @2.2 GHz
2,200 MHz
2,200,000 kHz
■ AMD Ryzen 5 2600 (6/12) @ 3.4 GHz3,400 MHz
3,400,000 kHz
■ ARM Holdings Baikal-M (8/8) @ 2 GHz2,000 MHz
2,000,000 kHz
■ Intel Core i9 i9-9990XE(14/28) @ 4 GHz
4,000 MHz
4,000,000 kHz
■ Intel Core i3 i3-9000T (4/4) @3.2 GHz
3,200 MHz
3,200,000 kHz
■ HiSilicon, ARM Holdings Kirin 980(8/8) @ 2.6 GHz
2,600 MHz
2,600,000 kHz
, 1.92 GHz
1,920 MHz
1,920,000 kHz
, 1.8 GHz
1,800 MHz
1,800,000 kHz
■ Intel Xeon W W-2104 (4/4) @3.2 GHz
3,200 MHz
3,200,000 kHz
■ AMD Ryzen Threadripper 3970X(32/64) @ 3.7 GHz
3,700 MHz
3,700,000 kHz
■ Intel Core i3 i3-8120 (4/4) @3.7 GHz
3,700 MHz
3,700,000 kHz
■ Intel Core i5 i5-8420T (6/6) ■ AMD Ryzen 5 PRO 1600 (6/12) @3.2 GHz
3,200 MHz
3,200,000 kHz
■ AMD Ryzen 7 2700 (8/16) @ 3.2 GHz3,200 MHz
3,200,000 kHz
■ Intel Core i7 i7-8706G (4/8) @3.1 GHz
3,100 MHz
3,100,000 kHz
■ Intel Core i9 i9-9820X(10/20) @ 3.3 GHz
3,300 MHz
3,300,000 kHz
■ Bitmain Sophon BM1684 ■ Intel Core i9 i9-9980XE(18/36) @ 3 GHz
3,000 MHz
3,000,000 kHz
■ Intel Core i3 i3-7320T (2/4) @3.6 GHz
3,600 MHz
3,600,000 kHz
■ AMD Ryzen 9 3950X (16/32) @ 3.5 GHz3,500 MHz
3,500,000 kHz
■ Intel Core i7 i7-8705G (4/8) @3.1 GHz
3,100 MHz
3,100,000 kHz
■ Intel Core i9 i9-9920X(12/24) @ 3.5 GHz
3,500 MHz
3,500,000 kHz
■ Intel Xeon W W-2140B (8/16) @3.2 GHz
3,200 MHz
3,200,000 kHz
■ Intel Core i3 i3-8320 (4/4) @3.8 GHz
3,800 MHz
3,800,000 kHz
■ HiSilicon, ARM Holdings Kirin 990 4G(8/8) @ 2.86 GHz
2,860 MHz
2,860,000 kHz
, 1.86 GHz
1,860 MHz
1,860,000 kHz
, 2.088 GHz
2,088 MHz
2,088,000 kHz
■ Intel Core i5 i5-8305G (4/8) @2.8 GHz
2,800 MHz
2,800,000 kHz
■ Intel Core i7 i7-8550U (4/8) @1.8 GHz
1,800 MHz
1,800,000 kHz
■ AMD Ryzen Threadripper 3990X (64/128) @ 2.9 GHz2,900 MHz
2,900,000 kHz
■ Intel Core i5 i5-8650 (6/6) ■ Intel Core i5 i5-8550 (6/6) ■ Intel Core i7 i7-8650U (4/8) @1.9 GHz
1,900 MHz
1,900,000 kHz
■ AMD Ryzen 7 PRO 1700X (8/16) @3.4 GHz
3,400 MHz
3,400,000 kHz
■ AMD Ryzen 5 2600X (6/12) @ 3.6 GHz3,600 MHz
3,600,000 kHz
■ AMD Ryzen Threadripper 3960X(24/48) @ 3.8 GHz
3,800 MHz
3,800,000 kHz
■ Intel Xeon W W-2135 (6/12) @3.7 GHz
3,700 MHz
3,700,000 kHz
■ AMD Ryzen 5 1400 (4/8) @ 3.2 GHz3,200 MHz
3,200,000 kHz
■ Qualcomm, ARM Holdings Snapdragon 800 8cx(8/8)
■ Intel Core i7 i7-7510U (2/4) @2.7 GHz
2,700 MHz
2,700,000 kHz
■ AMD Ryzen 5 1500X (4/8) @ 3.5 GHz3,500 MHz
3,500,000 kHz
■ Intel Core i5 i5-8420 (6/6) ■ Intel Celeron 3965Y (2/2) @1.3 GHz
1,300 MHz
1,300,000 kHz
■ Intel Core i3 i3-7007U (2/4) @2.1 GHz
2,100 MHz
2,100,000 kHz
■ Intel Core i3 i3-7110U (2/4) @2.6 GHz
2,600 MHz
2,600,000 kHz
■ Intel Core i9 i9-9960X(16/32) @ 3.1 GHz
3,100 MHz
3,100,000 kHz
■ Intel Core i9 i9-9900X(10/20) @ 3.5 GHz
3,500 MHz
3,500,000 kHz
■ Intel Core i3 i3-8020 (4/4) ■ PEZY PEZY-SCx PEZY-SC3 (8,192/65,536) @ 1.333 GHz1,333.333 MHz
1,333,333 kHz
■ Intel Core M3 M3-8114Y (2/4) @1.5 GHz
1,500 MHz
1,500,000 kHz
■ AMD Ryzen Threadripper 3980X(48/96) @ 3.2 GHz
3,200 MHz
3,200,000 kHz
■ Intel Xeon W W-2191B (18/36) @2.3 GHz
2,300 MHz
2,300,000 kHz
■ PEZY PEZY-SCx PEZY-SC4 (16,384/131,072) @ 1.6 GHz1,600 MHz
1,600,000 kHz
■ Intel Core i5 i5-8365U (4/8) @1.6 GHz
1,600 MHz
1,600,000 kHz
■ Bitmain Sophon BM1686 ■ Bitmain Sophon BM1880 ■ AMD Ryzen 3 PRO 1300 (4/4) @3.5 GHz
3,500 MHz
3,500,000 kHz
■ MediaTek Dimensity 1000L(8/8) @ 2.2 GHz
2,200 MHz
2,200,000 kHz
, 2 GHz
2,000 MHz
2,000,000 kHz
■ AMD Ryzen 5 1600 (6/12) @ 3.2 GHz3,200 MHz
3,200,000 kHz
■ Samsung, ARM Holdings Exynos 9610(8/8) @ 2.3 GHz
2,300 MHz
2,300,000 kHz
, 1.7 GHz
1,700 MHz
1,700,000 kHz
■ Intel Xeon W W-2150B (10/20) @3 GHz
3,000 MHz
3,000,000 kHz
■ Intel Core i5 i5-8650K (6/6) ■ Intel Core i5 i5-7210U (2/4) @2.5 GHz
2,500 MHz
2,500,000 kHz
■ Intel Core i3 i3-8320T (4/4) ■ Intel Core i3 i3-7120T (2/4) @3.5 GHz
3,500 MHz
3,500,000 kHz
■ AMD Ryzen 5 3500X (6/6) @ 3.6 GHz3,600 MHz
3,600,000 kHz
■ Intel Core i5 i5-8265U (4/8) @1.6 GHz
1,600 MHz
1,600,000 kHz
■ Intel Core i7 i7-8709G (4/8) @3.1 GHz
3,100 MHz
3,100,000 kHz
■ Intel Core i7 i7-9800X (8/16) @3.8 GHz
3,800 MHz
3,800,000 kHz
■ Intel Core i7 i7-8670 (6/12) ■ Intel Core i9 i9-9940X(14/28) @ 3.3 GHz
3,300 MHz
3,300,000 kHz
■ Socionext, ARM Holdings SC2A11(24/24) @ 1 GHz
1,000 MHz
1,000,000 kHz
■ Intel Xeon W W-2170B (14/28) @2.5 GHz
2,500 MHz
2,500,000 kHz
■ Xiaomi, ARM Holdings Surge S1 (8/8) @1.4 GHz
1,400 MHz
1,400,000 kHz
, 2.2 GHz
2,200 MHz
2,200,000 kHz
■ Intel Core i3 i3-7340 (2/4) @4.2 GHz
4,200 MHz
4,200,000 kHz
■ Intel Core i3 i3-7120 (2/4) @4 GHz
4,000 MHz
4,000,000 kHz
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